IP Library Patent Application 13103379
Patent Application
App. No. 13/103,379

ELECTROCONDUCTIVE LAMINATE AND PROTECTIVE PLATE FOR PLASMA DISPLAY

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
13/103,379
Abstract

To provide an electroconductive laminate which has an excellent electrical conductivity (electromagnetic wave shielding properties) and a high visible light transmittance and is excellent in productivity, and a protective plate for a plasma display which has excellent electromagnetic wave shielding properties and a broad transmission/reflection band and is excellent in productivity. An electroconductive laminate comprising a substrate and an electroconductive film formed on the substrate, wherein the electroconductive film has laminated n lamination units (wherein n is an integer of from 1 to 6) each having a first metal oxide layer, a second metal oxide layer and a metal layer arranged in this order from the substrate side, and further has a first metal oxide layer disposed as the outermost layer of the electroconductive film; the first metal oxide layer is an oxide layer containing titanium element and an M element, wherein the M element is at least one element selected from the group consisting of elements having atomic weights of at least 80, and the amount of the M element is from 10 to 60 atom % in the total amount of titanium element and the M element in the first metal oxide layer; the second metal oxide layer is a layer having, as its main component, an oxide containing zinc element; the metal layer is a layer having silver as its main component; and the second metal oxide layer and the metal layer in the lamination unit are directly in contact with each other.

Claims (24)

1 . An electroconductive laminate comprising a substrate and an electroconductive film formed on the substrate, wherein the electroconductive film has laminated n lamination units (wherein n is an integer of from 1 to 6) each having a first metal oxide layer, a second metal oxide layer and a metal layer arranged in this order from the substrate side, and further has a first metal oxide layer disposed as the outermost layer of the electroconductive film; the first metal oxide layer is an oxide layer containing titanium element and an M element, wherein the M element is at least one element selected from the group consisting of elements having atomic weights of at least 80, and the amount of the M element is from 10 to 60 atom % in the total amount of titanium element and the M element in the first metal oxide layer; the second metal oxide layer is a layer having, as its main component, an oxide containing zinc element; the metal layer is a layer having silver as its main component; and the second metal oxide layer and the metal layer in the lamination unit are directly in contact with each other.

2 . An electroconductive laminate comprising a substrate and an electroconductive film formed on the substrate, wherein the electroconductive film has laminated n lamination units (wherein n is an integer of from 1 to 6) each having a first metal oxide layer, a second metal oxide layer and a metal layer arranged in this order from the substrate side, and further has a first metal oxide layer disposed as the outermost layer of the electroconductive film; the first metal oxide layer is an oxide layer containing titanium element and an M element, wherein the M element is niobium element, tantalum element, zirconium element or hafnium element, and the amount of the M element is from 10 to 60 atom % in the total amount of titanium element and the M element in the first metal oxide layer; the second metal oxide layer is a layer having, as its main component, an oxide containing zinc element; the metal layer is a layer having silver as its main component; and the second metal oxide layer and the metal layer in the lamination unit are directly in contact with each other.

3 . The electroconductive laminate according to claim 1 , wherein the lamination unit further has a third metal oxide layer on the surface of the metal layer at the side opposite to the substrate, and the third metal oxide layer is a layer having, as its main component, an oxide containing zinc element.

4 . The electroconductive laminate according to claim 2 , wherein the M element is zirconium element.

5 . A protective plate for a plasma display, comprising a supporting substrate and an electroconductive laminate as defined in claim 1 , provided on the supporting substrate.

6 . A process for producing an electroconductive laminate, which comprises repeating the following steps (1) to (3) n times (wherein n is an integer of from 1 to 6);

and then forming a first metal oxide layer as the outermost layer by carrying out the following step (1):

(1) a step of forming a first metal oxide layer on one surface of a substrate by a sputtering method using a target containing titanium element and an M element (wherein the M element is at least one element selected from the group consisting of elements having atomic weights of at least 80);

(2) a step of forming a second metal oxide layer by a sputtering method using a target containing zinc element;

(3) a step of forming a metal layer by a sputtering method using a target containing silver as its main component.

7 . A process for producing an electroconductive laminate, which comprises repeating the following steps (1) to (4) n times (wherein n is an integer of from 1 to 6); and then forming a first metal oxide layer as the outermost layer by carrying out the following step (1):

(1) a step of forming a first metal oxide layer on one surface of a substrate by a sputtering method using a target containing titanium element and an M element (wherein the M element is at least one element selected from the group consisting of elements having atomic weights of at least 80);

(2) a step of forming a second metal oxide layer by a sputtering method using a target containing zinc element;

(3) a step of forming a metal layer by a sputtering method using a target containing silver as its main component;

(4) a step of forming a third metal oxide layer by a sputtering method using a target containing zinc element.

8 . A process for producing an electroconductive laminate, which comprises repeating the following steps (1) to (3) in total n times (wherein n is an integer of from 1 to 6); and then forming a first metal oxide layer as the outermost layer by carrying out the following step (1):

(1) a step of forming a first metal oxide layer on one surface of a substrate by a sputtering method using a target containing titanium element and an M element (wherein the M element is niobium element, tantalum element, zirconium element or hafnium element);

(2) a step of forming a second metal oxide layer by a sputtering method using a target containing zinc element;

(3) a step of forming a metal layer by a sputtering method using a target containing silver as its main component.

9 . A process for producing an electroconductive laminate, which comprises repeating the following steps (1) to (4) in total n times (wherein n is an integer of from 1 to 6); and then forming a first metal oxide layer as the outermost layer by carrying out the following step (1):

(1) a step of forming a first metal oxide layer on one surface of a substrate by a sputtering method using a target containing titanium element and an M element (wherein the M element is niobium element, tantalum element, zirconium element or hafnium element);

(2) a step of forming a second metal oxide layer by a sputtering method using a target containing zinc element;

(3) a step of forming a metal layer by a sputtering method using a target containing silver as its main component;

(4) a step of forming a third metal oxide layer by a sputtering method using a target containing zinc element.

Assignments (2)
CORPORATE ADDRESS CHANGE Recorded Nov 9, 2011
From: ASAHI GLASS COMPANY, LIMITED
To: ASAHI GLASS COMPANY, LIMITED
Reel/Frame 027197/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 10, 2011
From: KAWAMOTO, YASUSHI; SHIDOJI, EIJI; MAESHIGE, KAZUNOBU; MASHIMO, TAKAHIRO
To: ASAHI GLASS COMPANY, LIMITED
Reel/Frame 026249/0629 →