IP Library Granted Patent US 8,425,816
Granted Patent B2
US 8,425,816 · App. 13/105,080 · Granted Apr 23, 2013

Shaping slurry and shaping method

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Quick Facts
Patent No.
US 8,425,816
App. No.
13/105,080
Granted
Apr 23, 2013
Kind
B2
Abstract

A shaping slurry that forms a shaped product with a granule includes: a water-based solvent; a hydrophobic granule that forms the shaped product; and an amphiphatic solid polymer that forms the shaped product, and is dissolved in the water-based solvent.

Claims (11)

1. A shaping method for forming a shaped product by binding granules via a binding liquid,

the method comprising:

forming a layer of slurry on a base material, wherein the slurry includes a hydrophobic granule, a water-based solvent, and an amphiphatic solid polymer dissolved in the water-based solvent;

bonding the granule and the amphiphatic solid polymer to each other by curing the binding liquid after permeating a portion of the layer with the binding liquid; and

flowing a water-based liquid on the layer that includes the cured binding liquid, so as to remove the layer except for the region permeated with the binding liquid.

2. The shaping method according to claim 1 ,

wherein the layer forming step and the bonding step are alternately repeated to form a laminate of a plurality of layers that includes the cured binding liquid, and

wherein the water-based liquid is flown on the laminate in the removing step to remove the laminate except for the region permeated with the binding liquid.

3. The shaping method according to claim 1 , further comprising forming a sacrifice layer as a lowermost layer on the base material, wherein the sacrifice layer is formed of the slurry, and includes a smaller drop of the binding liquid than the layer formed in the layer forming step.

4. The shaping method according to claim 3 ,

wherein, in the sacrifice layer forming step, the binding liquid is discretely dropped onto the layer formed into the sacrifice layer, and cured.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 2, 2022
From: SEIKO EPSON CORP.
To: COLUMBIA PEAK VENTURES, LLC
Reel/Frame 058952/0475 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2011
From: OKAMOTO, EIJI; HIRAI, TOSHIMITSU; ISHIDA, KOHEI
To: SEIKO EPSON CORPORATION
Reel/Frame 026258/0438 →