Method of forming an electrical contact
A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.
1. A method of forming an electrical contact comprising:
assembling a panel, the panel having a printed circuit board having planar surfaces and one or more electrical components mounted on one or more of the planar surfaces, the panel having one or more conductive features enclosed within the panel and unexposed to an exterior surface of the panel, the one or more conductive features being located along a cut line;
cutting the panel along the cut line exposing portions of the one or more conductive features for use as electrical connections to the printed circuit board; and
treating the portions of the one or more conductive features exposed from the cutting for preservation as electrical connections.
2. The method of claim 1 wherein the treating further comprises applying solder to the portions of the one or more conductive features exposed from the cutting.
3. The method of claim 1 wherein the treating further comprises applying a conformal coating to the portions of the one or more conductive features exposed from the cutting to protect against oxidation.
4. The method of claim 1 wherein the treating further comprises applying a metal layer to the portions of the one or more conductive features exposed from the cutting.
5. The method of claim 1 wherein the treating further comprises attaching a lead of an adapter to the portions of the one or more conductive features exposed from the cutting.
6. The method of claim 1 further comprising covering at least one surface of the printed circuit board in an area including the cut line and the conductive features prior to cutting the printed circuit board.
7. The method of claim 6 wherein the covering comprises encapsulating the printed circuit board with a molding compound; and further comprising:
providing a registration feature having a predetermined relationship to the printed circuit board, and
using the registration feature to align the cutting relative to the cut line.
8. The method of claim 1 further comprising establishing a pattern including at least one conductive layer in the printed circuit board along the cut line to form the conductive features.
9. The method of claim 8 wherein the printed circuit board comprises a multilayer printed circuit board and the establishing a pattern includes establishing a plurality of conductive layers along the cut line to form the conductive features.
10. The method of claim 1 further comprising establishing a pattern including at least one conductive via in the printed circuit board along the cut line to form the conductive features.
11. The method of claim 10 wherein the conductive via is filled with a conductive material.
12. The method of claim 10 wherein the conductive via is buried in the printed circuit board.
13. The method of claim 10 wherein the conductive via is a through hole contacting the surfaces of the printed circuit board.
14. The method of claim 13 wherein the through hole is filled with a conductive material.
15. The method of claim 1 wherein the conductive features are covered at the surfaces of the printed circuit board by an insulation layer.
16. The method of claim 5 wherein the attaching further comprises soldering.
17. The method of claim 1 further comprising providing an adapter having one or more electrical terminals and wherein the treating comprises attaching the one or more electrical terminals to the portions of the one or more conductive features exposed from the cutting.
18. The method of claim 1 wherein the assembling further comprises encapsulating the planar surfaces of the printed circuit board.
19. The method of claim 18 wherein the assembling further comprises forming a plurality of circuits on the printed circuit board and the cutting further comprises separating the plurality of circuits from the panel.
20. The method of claim 19 wherein at least one of the conductive features is positioned along a cutline between two adjacent circuits of the plurality of circuits.
21. The method of claim 20 wherein the at least one conductive feature is electrically connected to each of the two adjacent circuits, the cutting leaves a respective portion of the at least one conductive feature exposed in each of the two adjacent circuits to form a respective electrical connection.
22. The method of claim 19 further comprising attaching an electrically conductive member to selected ones of the exposed portions.
23. A method of forming an electrical contact comprising:
assembling a panel including a substrate having one or more conductive features enclosed within the panel and unexposed to an exterior surface of the panel, the one or more conductive features being located along a cut line;
cutting the panel along the cut line exposing portions of the one or more conductive features for use as electrical connections to the substrate; and
treating the portions of the one or more conductive features exposed from the cutting for preservation as electrical connections;
wherein the substrate comprises a printed circuit board having planar surfaces, and the assembling further comprises encapsulating the planar surfaces of the printed circuit board;
wherein the assembling further comprises forming a plurality of circuits on the printed circuit board and the cutting further comprises separating the plurality of circuits from the panel.
24. The method of claim 23 wherein at least one of the conductive features is positioned along a cutline between two adjacent circuits of the plurality of circuits.
25. The method of claim 24 wherein the at least one conductive feature is electrically connected to each of the two adjacent circuits, the cutting leaves a respective portion of the at least one conductive feature exposed in each of the two adjacent circuits to form a respective electrical connection.
26. The method of claim 23 further comprising attaching an electrically conductive member to selected ones of the exposed portions.