IP Library Granted Patent US 8,488,918
Granted Patent B2
US 8,488,918 · App. 13/108,176 · Granted Jul 16, 2013

Semiconductor optical device, optical transmitter module, optical transceiver module, and optical transmission equipment

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Quick Facts
Patent No.
US 8,488,918
App. No.
13/108,176
Granted
Jul 16, 2013
Kind
B2
Abstract

Provided is a semiconductor optical device, which has a buried heterostructure structure and is formed in a structure capable of reducing a parasitic capacitance to further improve characteristics thereof, and also provided are an optical transmitter module, an optical transceiver module, and an optical transmission equipment. The semiconductor optical device includes a modulator portion for modulating light input along an emitting direction and radiating the modulated light, the modulator portion including: a mesa-stripe structure, which includes an active layer and extends in the emitting direction; and a buried layer provided adjacent to each side of the mesa-stripe structure, in which a distance between a lower surface of the buried layer and a lower surface of the active layer is 20% or more of a distance between the lower surface and an upper surface of the buried layer.

Claims (27)

1. A semiconductor optical device, comprising a modulator portion for modulating light input along an emitting direction and radiating the modulated light,

the modulator portion comprising:

a mesa-stripe structure, which includes an active layer and extends in the emitting direction, where the active layer has a lower guide layer, a multiple quantum well (MQW) layer, and an upper light guide layer; and

a buried layer disposed adjacent to each side of the mesa-stripe structure,

wherein a distance between a lower surface of the buried layer and a lower surface of the active layer is at least 1 μm and also is 20% or more of a distance between the lower surface and an upper surface of the buried layer.

2. The semiconductor optical device according to claim 1 , wherein the buried layer is made of a semiconductor doped with one of iron and ruthenium as an impurity.

3. The semiconductor optical device according to claim 1 , wherein the active layer contains one of an InGaAsP based material and an InGaAlAs based material.

4. The semiconductor optical device according to claim 1 , wherein the modulator portion comprises one of an electro-absorption modulator and a Mach-Zehnder modulator.

5. The semiconductor optical device according to claim 1 , further comprising an oscillator portion which is monolithically-integrated with the modulator portion, for outputting light to the modulator portion.

6. The semiconductor optical device according to claim 5 , wherein the oscillator portion comprises a distributed feedback semiconductor laser.

7. A semiconductor optical device module, comprising the semiconductor optical device according to claim 1 .

8. An optical transmitter module, comprising the semiconductor optical device module according to claim 7 .

9. An optical transceiver module, comprising the semiconductor optical device module according to claim 7 .

10. An optical transmission equipment, comprising the optical transmitter module according to claim 8 .

11. An optical transmission equipment, comprising the optical transceiver module according to claim 9 .

12. The semiconductor optical device of claim 1 , wherein the distance between the lower surface of the buried layer and the lower surface of the active layer is 1.8 μm.

13. A semiconductor optical device, comprising a modulator portion for modulating light input along an emitting direction and radiating the modulated light,

the modulator portion comprising:

a mesa-stripe structure, which includes an active layer and extends in the emitting direction, where the active layer has a lower light guide layer, a multiple quantum well (MQW) layer, and an upper light guide layer; and

a buried layer disposed adjacent to each side of the mesa-stripe structure,

wherein a distance between a lower surface of the buried layer and a lower surface of the active layer is greater than or equal to 1 μm and less than or equal to 5 μm, and also is 20% or more of a distance between the lower surface and an upper surface of the buried layer.

14. The semiconductor optical device according to claim 13 , wherein the buried layer is made of a semiconductor doped with one of iron and ruthenium as an impurity.

15. The semiconductor optical device according to claim 13 , wherein the active layer contains one of an InGaAsP based material and an InGaAlAs based material.

16. The semiconductor optical device according to claim 13 , wherein the modulator portion comprises one of an electro-absorption modulator and a Mach-Zehnder modulator.

17. The semiconductor optical device according to claim 13 , further comprising an oscillator portion which is monolithically-integrated with the modulator portion, for outputting light to the modulator portion.

18. The semiconductor optical device according to claim 17 , wherein the oscillator portion comprises a distributed feedback semiconductor laser.

19. The semiconductor optical device of claim 13 , wherein the distance between the lower surface of the buried layer and the lower surface of the active layer is 1.8 μm.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: LUMENTUM JAPAN, INC.
To: LUMENTUMRADIANT GMBH
Reel/Frame 073971/0379 →
CHANGE OF NAME Recorded Jul 2, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 049669/0609 →
CHANGE OF NAME Recorded Aug 17, 2012
From: OPNEXT JAPAN, INC.
To: OCLARO JAPAN, INC.
Reel/Frame 028807/0163 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2011
From: SUMI, SEIJI; HAYAKAWA, SHIGENORI; OKAMOTO, KAORU; YAMAUCHI, SHUNYA; SAKUMA, YASUSHI
To: OPNEXT JAPAN, INC.
Reel/Frame 026599/0794 →