Systems for circuit board heat transfer and method of assembling same
View Patent ↗A printed circuit board assembly is provided. The assembly includes a chassis, a heatframe coupled to the chassis, a printed circuit board (PCB), a thermal interface material (TIM) coupled between the PCB and the heatframe, and at least one thermal via extending through the PCB and coupled to the TIM, wherein the assembly is configured to transfer heat from the PCB to the chassis through the TIM and the at least one thermal via.
1. A printed circuit board assembly comprising
a chassis defining a slot through a wall thereof;
a heatframe disposed in said slot, said heatframe being engaged with and coupled to said chassis for heat exchange therebetween;
an expandable fastener disposed in said slot between said chassis and said heatframe for coupling said heatframe to said chassis;
a printed circuit board (PCB) mounted to said heatframe;
a thermal interface material (TIM) coupled between said PCB and said heatframe, said TIM being thermally conductive and electrically insulated; and
at least one thermal via extending through said PCB and coupled to said TIM, said thermal via for transferring heat from said PCB to said chassis through said TIM and said heatframe.
2. An assembly in accordance with claim 1 , wherein said at least one thermal via is composed of a thermally conductive and electrically conductive material.
3. An assembly in accordance with claim 1 , wherein said PCB comprises a plurality of circuit planes, and wherein said at least one thermal via is tied to at least one of said plurality of circuit planes.
4. An assembly in accordance with claim 3 , wherein said at least one thermal via is tied to at least one circuit ground plane of said plurality of circuit planes.
5. An assembly in accordance with claim 3 , wherein said at least one thermal via is tied to at least one circuit power plane of said plurality of circuit planes.
6. An assembly in accordance with claim 1 , wherein said PCB comprises at least one route layer and at least one plane layer, said assembly further comprising:
a mounting component coupled to said heatframe and extending through an aperture defined through said PCB;
a cooling plate coupled to said mounting component and oriented substantially co-planar with said at least one route layer, wherein said cooling plate overlaps at least a portion of said at least one plane layer to facilitate removing heat from said at least one plane layer.
7. A method of assembling a printed circuit board assembly, said method comprising:
providing a printed circuit board (PCB);
positioning at least one thermal via within the PCB;
coupling a thermal interface material (TIM) composed of a thermally conductive and electrically insulated material, to the at least one thermal via;
coupling the TIM to a heatframe;
coupling the PCB to the heatframe; and
coupling the heatframe to a chassis using an expandable fastener such that heat is transferred from the PCB to the chassis through the at least one thermal via, the TIM, and the heatframe.
8. A method in accordance with claim 7 , wherein providing a PCB comprises providing a PCB having a plurality of circuit planes, said method further comprises tying at least one of the plurality of circuit planes to the at least one thermal via.
9. A method in accordance with claim 8 , wherein tying at least one circuit plane to the at least one thermal via comprises tying a circuit ground plane to the at least one thermal via.
10. A method in accordance with claim 8 , wherein tying at least one circuit plane to the at least one thermal via comprises tying a circuit power plane to the at least one thermal via.