Semiconductor pressure sensor having a recess with a larger area than a planar shape of a diaphragm
View Patent ↗There is provided a semiconductor pressure sensor which improves the sensor sensitivity and is excellent in the withstand pressure characteristic and the temperature characteristic. In the semiconductor pressure sensor in which a diaphragm is formed by a cavity provided on one of top and bottom surfaces of a silicon substrate and a plurality of piezoresistors is disposed in the diaphragm edge, a recess which has a larger area than the planar shape of the diaphragm and whose entire edge is located outward from the diaphragm edge in plan view is provided in a protective film which covers the entire surface of the silicon substrate on the diaphragm side. The protective film located on the diaphragm is preferably formed of SiO 2 .
1. A semiconductor pressure sensor in which a diaphragm is formed by a cavity provided on one of top and bottom surfaces of a silicon substrate and a plurality of piezoresistors is disposed in the diaphragm edge, comprising:
a protective film which covers the entire surface of the silicon substrate on the diaphragm side,
wherein a recess which has a larger area than a planar shape of the diaphragm and whose entire edge is located outward from the diaphragm edge in plan view is provided in the protective film.
2. The semiconductor pressure sensor according to claim 1 , wherein an edge of the recess is located outward from the plurality of piezoresistors in plan view.
3. The semiconductor pressure sensor according to claim 1 , wherein a planar shape of the recess is similar to the planar shape of the diaphragm.
4. The semiconductor pressure sensor according to claim 1 , wherein the recess is formed except for a position overlapping a bonding pad for the piezoresistor formed in the silicon substrate.
5. The semiconductor pressure sensor according to claim 1 , wherein the protective film located on the diaphragm is formed of SiO 2 .
6. The semiconductor pressure sensor according to claim 5 , wherein the protective film has an SiO 2 film which covers the piezoresistors and an SiN film which covers a circuit wiring section of the piezoresistors disposed on the SiO 2 film, and the recess is formed with a depth which exposes the SiO 2 film.
7. The semiconductor pressure sensor according to claim 5 , wherein the protective film has a first SiO 2 film which covers the piezoresistors, a second SiO 2 film which covers a circuit wiring section of the piezoresistors disposed on the first SiO 2 film, and an SiN film which covers the second SiO 2 film, and the recess is formed with a depth which exposes the second SiO 2 film.
8. The semiconductor pressure sensor according to claim 5 , wherein the protective film has a first SiO 2 film which covers the piezoresistors and a second SiO 2 film which covers a circuit wiring section of the piezoresistors disposed on the first SiO 2 film, and the recess is formed with a depth which exposes the second SiO 2 film.
9. The semiconductor pressure sensor according to claim 1 , wherein the entire surface on the diaphragm side is flat and the recess is formed by reducing the thickness of the protective film which covers the entire surface on the diaphragm side.