Fluid ejection devices and methods for fabricating fluid ejection devices
View Patent ↗Disclosed is a fluid ejection device for an inkjet printer that includes a substrate having at least one fluid flow channel configured within a bottom portion of the substrate. Each fluid flow channel of the at least one fluid flow channel is configured by etching the bottom portion. The substrate also includes a plurality of fluid flow vias configured within a top portion of the substrate. Each fluid flow via of the plurality of fluid flow vias is configured by etching the top portion. The each fluid flow via is further configured to be in fluid communication with a corresponding fluid flow channel through an isotropically etched cavity configured below the each fluid flow via and fluidically coupled to the corresponding fluid flow channel. The fluid ejection device also includes a flow feature layer and a nozzle plate. Further disclosed are methods for fabricating fluid ejection devices.
1. A fluid ejection device for an inkjet printer, the fluid ejection device comprising:
a substrate comprising,
at least one fluid flow channel configured within a bottom portion of the substrate, each fluid flow channel of the at least one fluid flow channel being configured within the bottom portion by etching the bottom portion at a first predetermined etching rate, and
a plurality of fluid flow vias configured within a top portion of the substrate, each fluid flow via of the plurality of fluid flow vias being configured within the top portion by etching the top portion at a second predetermined etching rate so that each fluid flow via of the plurality of fluid flow vias has a finely controlled depth so that the planarity of the substrate is maintained, the each fluid flow via of the plurality of fluid flow vias further being configured to be in fluid communication with a corresponding fluid flow channel of the at least one fluid flow channel through an isotropically etched cavity configured below the each fluid flow via and fluidically coupled to the corresponding fluid flow channel;
a flow feature layer configured over the substrate, the flow feature layer comprising a plurality of flow feature channels, wherein at least one flow feature channel of the plurality of flow feature channels is in fluid communication with a corresponding fluid flow via of the plurality of fluid flow vias; and
a nozzle plate configured over the flow feature layer, the nozzle plate comprising a plurality of nozzles, wherein at least one nozzle of the plurality of nozzles is in fluid communication with a corresponding flow feature channel of the plurality of flow feature channels.
2. The fluid ejection device of claim 1 , wherein the plurality of fluid flow vias is configured over the each fluid flow channel of the at least one fluid flow channel.
3. The fluid ejection device of claim 2 , wherein the plurality of fluid flow vias is configured in at least one row arranged over the each fluid flow channel.
4. The fluid ejection device of claim 1 , wherein the first etching rate is faster than the second etching rate.
5. The fluid ejection device of claim 1 , wherein the bottom portion is etched by deep reactive ion etching technique.
6. The fluid ejection device of claim 1 , wherein the top portion is etched by deep reactive ion etching technique.
7. The fluid ejection device of claim 1 , wherein the substrate further comprises at least one via bridge, each via bridge of the at least one via bridge being configured within the bottom portion of the substrate and between two adjacent fluid flow channels of the at least one fluid flow channel.
8. The fluid ejection device of claim 1 , wherein the each fluid flow via has a depth ranging from about 10 microns to about 100 microns.