Precision laser ablation
View Patent ↗Methods and systems for precisely removing selected layers of materials from a multi-layer work piece using laser ablation are disclosed. Precise removal of one or more selected layers of materials of a work piece may be performed by irradiating at least one location on a multi-layer work piece with a laser beam, ablating material at the at least one location, detecting one or more characteristics of the material ablated at the at least one location and analyzing the one or more characteristics to identify a change in at least one of the one or more characteristics that indicates a change in the type of material being ablated. Related systems are also described.
1. A laser ablation method comprising:
irradiating a first location on the surface of a workpiece having at least one layer of a first material of finite thickness with a series of laser pulses from a first laser source;
ablating the first layer with the series of pulses at the at least one location;
monitoring the presence of one or more characteristics of the ablated first material after each pulse such that the absence of the one or more characteristics can be determined; and
identifying the completion of ablation of the layer of first material at the first location upon the determination of the presence of the one or more characteristics being lower than a threshold value.
2. The method of claim 1 , further comprising terminating the ablating within one pulse period, upon identifying the completion of ablation of the layer of first material.
3. The method of claim 1 , further comprising changing the first location to a second location in response to identifying the completion of ablation of the layer of first material at the first location.
4. The method of claim 1 , wherein the work piece is cylindrical and the thickness of the layer of material is asymmetrical.
5. The method of claim 1 , wherein the work piece is non-cylindrical and the thickness of the layer of material is non-uniform.
6. The method of claim 1 , wherein the one or more characteristics are selected from the group consisting of: optical signature of the surface of the first location, ablation plume emissions, and fluorescence.
7. The method of claim 6 , wherein:
the one or more characteristics comprise ablation plume emissions;
the ablation plume emissions comprise light emissions;
the light emissions are filtered via an optical filter to admit only a spectral component of the light emissions that is characteristic of the layer of first material; and
ablating is terminated within one pulse period upon identifying the absence of the spectral component.
8. The method of claim 6 , wherein:
the one or more characteristics comprise fluorescence;
the fluorescence is filtered via an optical filter to admit only a spectral component of the fluorescence that is characteristic of the layer of first material; and
ablating is terminated within one pulse period upon identifying the absence of the spectral component.
9. The method of claim 6 , wherein:
the one or more characteristics comprise and optical signature of the surface of the first location upon an illuminating beam of light being directed thereon;
the light reflected from the surface is analyzed to determine an optical signature that is characteristic of the layer of first material, wherein
ablating is terminated within one pulse period upon identifying the absence of the optical signature.
10. The method of claim 9 , wherein the illuminating beam is the first laser source.
11. The method of claim 9 , wherein the illuminating beam is a second beam from a second laser source.
12. A laser ablation system comprising:
a first source of light comprising a laser light-emitting device for irradiating a first location on the surface of a multi-layer work piece with a series of laser pulses from a first laser beam;
a detector configured for generating at least one signal after each pulse, the signal relating to one or more characteristics of the material ablated after each pulse corresponding to a first layer of the multi-layer work piece at the first location; and
a processor having instructions operable thereon and configured to at least one of operate and control at least the laser light-emitting device,
wherein the instructions additionally are configured to enable the processor to:
analyze the at least one signal to monitor the presence of the one or more characteristics of the layer of first material such that the absence of the one or more characteristics can be determined; and
identifying the completion of ablation of the layer of first material at the first location upon the determination of the one or more characteristics being below a threshold value.
13. The system of claim 12 , wherein the instructions are further configured to enable the processor to terminate the delivery of pulses upon determining the absence of the one or more characteristics after a pulse.
14. The system of claim 12 , wherein the instructions are further configured to enable the processor to terminate the delivery of pulses within a pulse period, upon determining the absence of the one or more characteristics after a pulse.
15. The system of claim 12 , wherein the instructions are further configured to enable the processor to cause irradiation of a second location on the surface of the workpiece.
16. The system of claim 12 , wherein the detector is selected from the group consisting of alight sensor such as photodiode or photon multiplier tube, and combination thereof.
17. The system of claim 12 , further comprising a peak-and-hold circuit to allow pulsed signal detection.
18. The system of claim 12 , wherein the one or more characteristics are light emissions selected from the group consisting of optical signature of the surface, ablation plume emissions, fluorescence.
19. The system of claim 18 , further comprising a filter to pass only a spectral component of the light emission that is characteristic of the layer of first material.
20. The system according to claim 18 , wherein the light emissions correspond to an optical signal of the surface, and wherein the system further comprises a second light source for producing the irradiating the surface at the first location to create the optical signal.