Device for measuring environmental forces and method of fabricating the same
View Patent ↗A device for measuring environmental forces, and a method for fabricating the same, is disclosed that comprises a device wafer, the device wafer comprising a first device layer separated from a second device layer by a first insulation layer. The first device wafer is bonded to an etched substrate wafer to create a suspended diaphragm and boss, the flexure of which is determined by an embedded sensing element.
1. A device comprising:
a device wafer comprising a first device layer and a second device layer, said first device layer separated from said second device layer by a first insulation layer;
a boss comprising a portion of the first device layer, the boss adjacent to the first insulation layer;
a substrate wafer comprising a diaphragm cavity located on a first surface surface of the substrate wafer, said first surface of said substrate wafer bonded to a first surface of said first device layer to form a diaphragm over said diaphragm cavity, said diaphragm comprising a portion of said second device layer, and said boss extending from said diaphragm toward the diaphragm cavity; and
a sensing element located in said second device layer to sense flexure in said diaphragm.
2. The device of claim 1 , further comprising:
an interconnect located in said second device layer, said interconnect being in electrical communication with said sensing element; and
a metallization layer, said metallization layer providing electrical communication between an outer surface of said device and said interconnect.
3. The device of claim 1 , wherein said sensing element comprises a piezoresistive sensing element.
4. The device of claim 1 , wherein said substrate wafer comprises a double side polished wafer.
5. The device of claim 1 , wherein said substrate wafer comprises a device layer of a silicon-on-insulator wafer.
6. The device of claim 1 , wherein said device measures absolute pressure.
7. The device of claim 1 , wherein said diaphragm cavity extends entirely through said substrate wafer.
8. The device of claim 7 , wherein said device measures differential pressure.
9. The device of claim 1 , wherein said device measures low pressure.
10. The device of claim 1 , wherein the thickness of said substrate wafer is chosen to minimize the packaging stress transferred to said diaphragm.
11. A method for fabricating a device comprising the steps of:
providing a device wafer, said device wafer comprising a first device layer, and a second device layer separated from said first device layer by a first insulation layer;
forming a boss in the first device layer, the boss adjacent to the first insulation layer;
providing a substrate wafer;
forming a diaphragm cavity on a first surface of the substrate wafer;
bonding a first surface of said first device layer to said first surface of said substrate wafer, including forming a diaphragm over said diaphragm cavity, said diaphragm comprising a portion of said second device layer, and said boss extending from said diaphragm; and placing a sensing element in said second device layer to sense flexure in said diaphragm.
12. The method of claim 11 , further comprising the steps of:
placing an interconnect in said second device layer, said interconnect being in electrical communication with said sensing element; and
forming a metallization layer, said metallization layer providing electrical communication between an outer surface of said sensor and said interconnect.
13. The method of claim 11 , wherein said sensing element comprises a piezoresistive sensing element.
14. The method of claim 11 , wherein said substrate wafer comprises a double side polished wafer.
15. The method of claim 11 , wherein said substrate wafer comprises a device layer of a silicon-on-insulator wafer having a second insulation layer located between said device layer and a handle layer.
16. The method of claim 15 , further comprising the step of removing said handle layer and said second insulation layer from said silicon-on-insulator wafer.
17. The method of claim 11 , wherein said device measures absolute pressure.
18. The method of claim 11 , further comprising the step of thinning said substrate wafer to expose said diaphragm cavity.
19. The method of claim 18 , wherein said device measures differential pressure.
20. The method of claim 11 , wherein the thickness of said substrate wafer is chosen to minimize the packaging stress transferred to said diaphragm.