Glass member provided with sealing material layer, and electronic device using it and process for producing the electronic device

1. A glass member provided with a sealing material layer, which comprises a glass substrate having a sealing region; and a sealing material layer comprising a glass material for sealing containing a low-expansion filler comprising low-expansion filler particles and a laser absorbent, provided on the sealing region of the glass substrate; wherein the glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layer and contains low-expansion filler particles having particles sizes within a range of from 0.5 T to 1 T based on the thickness T of the sealing material layer in a volume ratio of from 0.1 to 50%.

2. The glass member provided with a sealing material layer according to claim 1 , wherein the low-expansion filler comprises at least one member selected from silica, alumina, zirconia, zirconium silicate, cordierite, a zirconium phosphate compound, soda lime glass and borosilicate glass, and the glass material for sealing contains the low-expansion filler in an amount of from 15 to 50 vol %.

3. The glass member provided with a sealing material layer according to claim 1 , wherein the laser absorbent comprises at least one metal selected from Fe, Cr, Mn, Co, Ni and Cu or a compound containing the metal, and the glass material for sealing contains the laser absorbent in an amount of from 0.1 to 10 vol %.

4. The glass member provided with a sealing material layer according to claim 1 , wherein the glass material for sealing contains the low-expansion filler particles having particle sizes within a range of from 0.5 T to 1 T in a volume ratio of from 0.1 to 10%.

5. The glass member provided with a sealing material layer according to claim 1 , wherein the glass substrate comprises soda lime glass or alkali-free glass.

6. The glass member provided with a sealing material layer according to claim 1 , wherein the glass material for sealing contains, as the main component, sealing glass comprising tin-phosphate glass or bismuth glass.

7. The glass member provided with a sealing material layer according to claim 1 , wherein said volume ratio is from 0.1 to 25.6%.

8. The glass member provided with a sealing material layer according to claim 1 , wherein said low-expansion filler is contained in an amount of 15 to 50 vol %.

9. The glass member provided with a sealing material layer according to claim 1 , wherein said glass substrate has a thermal expansion coefficient of 35 to 40×10 −7 /° C. and said low-expansion filler is contained in an amount of 30 to 50 vol %.

10. The glass member provided with a sealing material layer according to claim 1 , wherein said glass substrate has a thermal expansion coefficient of 85 to 90×10 −7 /° C. and said low-expansion filler is contained in an amount of 15 to 40 vol %.

11. The glass member provided with a sealing material layer according to claim 1 , wherein said sealing material layer has a thickness of from 6 to 120 μm.

12. The glass member provided with a sealing material layer according to claim 1 , wherein said sealing material layer has a thickness of from 10 to 65 μm.

13. An electronic device which comprises a first glass substrate having an element-formed region provided with an electronic element and a first sealing region provided on the outer peripheral side of the element-formed region; a second glass substrate having a second sealing region corresponding to the first sealing region of the first glass substrate; and a sealing layer comprising a melt-bonded layer of a glass material for sealing containing a low-expansion filler comprising low-expansion filler particles and a laser absorbent, formed to seal a space between the first sealing region of the first glass substrate and the second sealing region of the second glass substrate while a space is provided on the element-formed region; wherein the glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness Ta of the sealing layer and contains low-expansion filler particles having particles sizes within a range of from 0.5 Ta to 1 Ta based on the thickness Ta of the sealing layer in a volume ratio of from 0.1 to 50%.

14. The electronic device according to claim 13 , wherein the electronic element is an organic EL element or a solar cell element.

15. A process for producing an electronic device, which comprises a step of preparing a first glass substrate having an element-formed region provided with an electronic element and a first sealing region provided on the outer peripheral side of the element-formed region; a step of preparing a second glass substrate having a second sealing region corresponding to the first sealing region of the first glass substrate, and a sealing material layer comprising a glass material for sealing containing a low-expansion filler comprising low-expansion filler particles and a laser absorbent, formed on the second sealing region; a step of laminating the first glass substrate and the second glass substrate via the sealing material layer while a space is formed on the element-formed region; and a step of irradiating the sealing material layer with a laser light through the second glass substrate to melt the sealing material layer thereby to form a sealing layer to seal the space between the first glass substrate and the second glass substrate; wherein the glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layer and contains low-expansion filler particles having particles sizes within a range of from 0.5 T to 1 T based on the thickness T of the sealing material layer in a volume ratio of from 0.1 to 50%.

16. The process for producing an electronic device according to claim 15 , wherein the electronic element is an organic EL element or a solar cell element.