IP Library Granted Patent US 8,497,519
Granted Patent B2
US 8,497,519 · App. 13/114,730 · Granted Jul 30, 2013

Batwing LED with remote phosphor configuration

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Quick Facts
Patent No.
US 8,497,519
App. No.
13/114,730
Granted
Jul 30, 2013
Kind
B2
Abstract

An LED emitter uses a molded lens with phosphor material embedded in a circumferential trench to generate a batwing beam pattern. After the lens is molded over a package substrate with connected LED dies thereon, the phosphor material is molded, injected, or dispensed into a circumferential trench. The molded lens is shaped such that a majority of the light emitted by the one or more LED dies is reflected by the top surface to the side surfaces through the phosphor material.

Claims (23)

1. An optical emitter comprising:

one or more Light-Emitting Diode (LED) dies;

a package substrate attached to one side of the one or more LED dies;

electrical connections between the one or more LED dies and terminals on the package substrate;

a molded lens bonded to the package substrate directly contacting the one or more LED dies, said molded lens configured to transmit light from the one or more LED dies in a batwing pattern; and,

phosphor material embedded in the molded lens in a circumferential cylinder shape.

2. The optical emitter of claim 1 , further comprising a high reflectivity coating on a top surface of the molded lens.

3. The optical emitter of claim 2 , wherein the high reflectivity coating includes a metal or a metal oxide.

4. The optical emitter of claim 2 , wherein the high reflectivity coating covers the entire top surface of the molded lens.

5. The optical emitter of claim 1 , wherein the one or more LED dies are at least four LED dies disposed around a center point on the package substrate.

6. The optical emitter of claim 1 , wherein the one or more LED dies are configured to emit a blue light.

7. The optical emitter of claim 6 , wherein the circumferential cylinder has a varying thickness.

8. The optical emitter of claim 1 , wherein the molded lens includes a top surface having a cavity shaped to internally reflect light emitted by the one or more LED dies to the side surfaces of the lens.

9. The optical emitter of claim 1 , wherein the molded lens is a silicone, a resin, an epoxy, or a poly(methyl methacrylate) (PMMA).

10. The optical emitter of claim 1 , wherein the electrical connections connect the one or more LED dies in series and connect end LED dies to terminals on the package substrate.

11. The optical emitter of claim 1 , wherein the molded lens base is a circle.

12. A display comprising:

a plurality of optical emitters, each optical emitter comprising:

a plurality of Light-Emitting Diode (LED) dies;

a package substrate attached to one side of the plurality of LED dies;

electrical connections connecting the LED die and the package substrate;

a molded lens bonded to the package substrate directly contacting the one or more LED dies, said molded lens configured to transmit light from the one or more LED dies in a batwing pattern; and,

phosphor material circumferentially embedded in the molded lens.

Assignments (4)
CHANGE OF NAME Recorded Nov 24, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037158/0101 →
MERGER Recorded Nov 24, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037158/0154 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027990/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2011
From: CHEN, CHING-YI; TANG, YU-SHENG; YANG, HAO-YU; CHEN, HSIN-HUNG; SHIH, TZU-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026333/0714 →