IP Library Granted Patent US 8,759,854
Granted Patent B2
US 8,759,854 · App. 13/114,787 · Granted Jun 24, 2014

Bat-wing lens design with multi-die

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,759,854
App. No.
13/114,787
Granted
Jun 24, 2014
Kind
B2
Abstract

A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating.

Claims (26)

1. An optical emitter comprising: a plurality of Light-Emitting Diode (LED) dies; a package substrate attached to one side of the plurality of LED dies; electrical connections between the LED dies and terminals on the package substrate; and a molded lens bonded to the package substrate over the LED dies, said molded lens having a top surface that includes a batwing surface formed by rotating an arc about a line at an end of the arc parallel to a conjugate axis of a curve, and wherein a center of each of the plurality of LED dies is mounted to the package substrate around a focus of a curve whose arc forms the batwing surface.

2. The optical emitter of claim 1 , wherein the curve is a parabola or a half of a hyperbola.

3. The optical emitter of claim 1 , wherein the molded lens includes a high reflectivity coating on the batwing surface.

4. The optical emitter of claim 3 , wherein the high reflectivity coating reflects at least 90% of incident light.

5. The optical emitter of claim 3 , wherein the high reflectivity coating includes a metal.

6. The optical emitter of claim 1 , wherein an axis of symmetry of the curve lies on a top surface of the package substrate.

7. The optical emitter of claim 1 , wherein around a focus of a curve is between 0.5 to 1.5 of a focal distance from the vertex of the curve.

8. The optical emitter of claim 7 , wherein the plurality of LEDs comprises a first portion of LEDs with centers mounted to the package substrate at a first distance from the vertex of the parabola and a second portion of LEDs with centers mounted to the package substrate at a second distance from the vertex of the parabola.

9. The optical emitter of claim 8 , wherein the plurality of LEDs further comprises a third portion of LEDs with centers mounted to the package substrate at a third distance from the vertex of the parabola.

10. The optical emitter of claim 1 , wherein the molded lens is a silicone, a resin, an epoxy, or a poly(methyl methacrylate) (PMMA).

11. The optical emitter of claim 1 , wherein the optical emitter is about or smaller than 3.5 mm by 3.5 mm.

12. A lighting device comprising an optical emitter, the optical emitter comprising: one or more Light-Emitting Diode (LED) dies; a package substrate attached to one side of the plurality of LED dies; electrical connections between terminals on the package substrate and the LED dies; and a molded lens bonded to the package substrate over the LED dies, wherein an upper surface of said molded lens includes a batwing surface formed by horizontally rotating a parabolic arc about an end of the parabolic arc, and wherein a center of each of the plurality of LED dies is mounted to the package substrate about a focus ring of a rotating parabola whose arc forms the batwing surface.

13. The lighting device of claim 12 , wherein about the focus ring of a rotating parabola is within a circle at 0.5 of a focal distance from the vertex of the parabola and another circle at 1.5 of the focal distance from the vertex of the parabola.

14. The lighting device of claim 12 , wherein the one or more LED dies is one LED die.

15. The lighting device of claim 12 , further comprising electrical connections between LED dies.

16. An optical emitter, comprising:

a package substrate;

a plurality of Light-Emitting Diode (LED) dies disposed over, and electrically coupled to, the package substrate; and

a molded lens disposed over the package substrate and covering the LED dies;

wherein:

the molded lens has a cylindrical body and a batwing surface at a top of the body; and

a location of each of the LED dies is correlated with a shape of the batwing surface.

17. The optical emitter of claim 16 , wherein the batwing surface has a concave curved face that forms a valley with a lowest point at a center and highest points at a circumferential edge.

18. The optical emitter of claim 16 , wherein the batwing surface is defined by rotating an arc about a vertical axis at an end of the arc.

19. The optical emitter of claim 16 , wherein a center of each of the LED dies is located about a focus of a parabola whose arc forms the batwing surface.

20. The optical emitter of claim 16 , wherein a distance between the center of each of the LED dies to a vertex of the parabola is around a focal distance, wherein the focal distance is a horizontal distance between the vertex and a focus of the parabola.

Assignments (5)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
CHANGE OF NAME Recorded Dec 3, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037208/0159 →
MERGER Recorded Dec 3, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037457/0493 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027989/0971 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2011
From: CHEN, CHING-YI; YANG, HAO-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026334/0923 →