Communications module with a shell assembly having thermal mechanical features
View Patent ↗In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel.
1. A communications module, comprising:
a transceiver assembly having at least one printed circuit board defining a printed circuit board interface plane and a transmitter/receiver assembly coupled to the printed circuit board, the transmitter/receiver assembly being oriented at a first angle relative to the printed circuit board interface plane; and
a shell assembly defining a cavity therein, the transceiver assembly being positioned within the cavity, wherein the shell assembly further comprises a thermal boss including a thermal interface surface defining a thermal interface plane, the thermal interface plane being oriented at a second angle relative to the printed circuit board interface plane,
wherein the transceiver assembly includes a transmitter, a receiver, and a lens block in thermal communication with the thermal boss, the communications module further comprising a biasing member configured to bias the lens block toward the thermal boss.
2. The communications module of claim 1 , wherein the thermal interface plane is substantially perpendicular to the printed circuit board interface plane such that the second angle is about 90 degrees.
3. The communications module of claim 1 , further comprising an alignment guide configured to be positioned at least partially within the shell assembly, wherein the biasing member is positioned between the alignment guide and the lens block.
4. The communications module of claim 3 , further comprising an electromagnetic interference (EMI) plate having a main body, wherein the biasing member includes protrusions extending away from the main body.
5. The communications module of claim 4 , wherein:
the protrusions of the EMI plate extend both away from the main body of the EMI plate and in a first direction parallel to the printed circuit board interface plane; and
the EMI plate further comprises a plurality of fingers that extend around a perimeter of the EMI plate both away from the main body of the EMI plate and in a second direction that is opposite the first direction.
6. The communications module of claim 1 , further comprising an integrated circuit plate positioned between the lens block and the thermal boss, the transmitter and receiver being positioned on the integrated circuit plate.
7. The communications module of claim 6 , further comprising at least one thermal interface material positioned between the integrated circuit plate and the thermal boss.
8. The communications module of claim 7 , wherein the thermal interface material includes at least one of a phase change material, one or more thermal pads, or thermal grease.
9. The communications module of claim 1 , wherein the transceiver assembly comprises a first printed circuit board that defines the printed circuit board interface plane and a second printed circuit board that defines a second plane that is parallel to and offset from the printed circuit board interface plane.
10. The communications module of claim 9 , further comprising an integrated circuit plate that defines a third plane that is orthogonal to the printed circuit board interface plane and the second plane, wherein the transmitter and the receiver are positioned on the integrated circuit plate.
11. The communications module of claim 1 , wherein the transmitter comprises an array of lasers and the receiver comprises an array of photodiodes.
12. The communications module of claim 11 , wherein the array of lasers comprises a 12×1 array of vertical cavity surface-emitting lasers and the array of photodiodes comprises a 12×1 array of p-type, intrinsic, n-type photodiodes.
13. A communications module, comprising:
a shell assembly having a top panel, a bottom panel, and opposing lateral sides defining a cavity therebetween;
a thermal boss extending from the top panel, the thermal boss including a thermal interface surface defining a thermal interface plane oriented at a first angle relative to the top panel;
a transceiver assembly having at least one printed circuit board defining a printed circuit board interface plane that is substantially parallel to the top panel and a transmitter/receiver assembly coupled to the printed circuit board and oriented at a second angle relative to the printed circuit board interface plane, the second angle being substantially equal to the first angle; and
a biasing member configured to bias the transmitter/receiver assembly into contact with the thermal interface surface.
14. The communications module of claim 13 , wherein the first angle is about 90 degrees.
15. The communications module of claim 13 , further comprising a thermal interface material positioned between the thermal interface surface and the transmitter/receiver assembly.
16. The communications module of claim 13 , wherein the transmitter/receiver assembly includes a transmitter and a receiver coupled to an integrated circuit plate.
17. The communications module of claim 13 , further comprising at least one flex circuit coupling the printed circuit board to the transmitter/receiver assembly.
18. The communications module of claim 13 , wherein the transceiver assembly is an optoelectronic transceiver assembly.
19. The communications module of claim 13 , further comprising an alignment guide coupled to the shell assembly and extending at least partially into the cavity; the biasing member being positioned between the alignment guide and the thermal boss.
20. The communications module of claim 13 , wherein the transceiver assembly comprises a first printed circuit board that defines the printed circuit board interface plane and a second printed circuit board that defines a second plane that is parallel to and offset from the printed circuit board interface plane.
21. The communications module of claim 20 , further comprising an integrated circuit plate that defines a third plane that is orthogonal to the printed circuit board interface plane and the second plane, wherein a transmitter and a receiver of the transmitter/receiver assembly are positioned on the integrated circuit plate.
22. The communications module of claim 21 , wherein the transmitter comprises a 12×1 array of vertical cavity surface-emitting lasers and the receiver comprises a 12×1 array of p-type, intrinsic, n-type photodiodes.