THIN FILM PELTIER THERMAL LIGHT POWER BARRIER COOLER
A light powered barrier for cooling a substrate includes a thermo-conductive layer for contacting the substrate, a first P-type layer disposed atop the thermo-conductive layer, a first N-type layer disposed over the first P-type layer and a thermoelectrically conductive insert that conducts heat from the thermo-conductive layer and electrically conducts electrons and holes from the first P-type layer and the first N-type layer.
1 . A light powered barrier for cooling a substrate comprising:
a thermo-conductive layer for contacting said substrate;
a first P-type layer disposed atop said thermo-conductive layer;
a first N-type layer disposed over said first P-type layer; and
a thermoelectrically conductive insert that conducts heat from said thermo-conductive layer and electrically conducts electrons and holes from said first P-type layer and said first N-type layer.
2 . The barrier of claim 1 wherein said insert has a portion atop said first P-type layer.
3 . The barrier of claim 1 further comprising a second N-type layer disposed atop said first N-type layer.
4 . The barrier of claim 1 wherein said thermo-conductive layer further comprises a mesh layer disposed in contact with said P-type layer.
5 . The barrier of claim 1 wherein said thermo-conductive layer further comprises a mesh layer disposed in contact with said insert.
6 . The barrier of claim 1 further comprising a second P-type layer disposed atop said thermo-conductive layer in close proximity to said first P-type layer.
7 . The barrier of claim 6 wherein said insert comprises a vertical portion contacting said first and second P-type layers and a cross portion contacting a top of said first and second P-type layers.
8 . A method for cooling a substrate comprising:
providing a thermo-conductive layer for contacting a substrate to be cooled;
providing a first P-type layer disposed atop said thermo-conductive layer;
providing an N-type layer disposed over said first P-type layer;
providing a thermoelectrically conductive insert that conducts heat from said thermo-conductive layer and electrically conducts electrons and holes between said first P-type layer and said N-type layer; and
exposing said N-type layer to light to induce the conduction of electrons and holes from said thermo-conductive layer, said first P-type layer and said N-type layer to draw heat away from said substrate through said insert to ambient.
9 . The method of claim 8 further comprising placing a cross portion of said insert atop said first P-type layer.
10 . The method of claim 8 wherein said N-type layer is comprised of a second N-type layer placed atop a first N-type layer.
11 . The method of claim 8 wherein providing said thermo-conductive layer further comprises placing a mesh layer in contact with said first P-type layer and said thermo-conductive layer and said insert.
12 . The method of claim 8 further comprising placing a second P-type layer atop said thermo-conductive layer in close proximity to said first P-type layer.
13 . The method of claim 12 further comprising:
contacting a vertical portion of said insert with said first and second P-type layers and placing a cross portion of said insert in contact with a top of said first and second P-type layers.
14 . A method for constructing a light powered bather for cooling a substrate comprising:
providing a thermo-conductive layer for contacting a substrate;
laying a first P-type layer atop said thermo-conductive layer;
laying a first N-type layer atop said first P-type layer; and
placing a thermoelectrically conductive insert in close proximity to said thermo-conductive layer, said first P-type layer and said first N-type layer such that said insert conducts heat from said thermo-conductive layer and electrically conducts electrons and holes from said first P-type layer and said first N-type layer.
15 . The method of claim 14 further comprising placing a cross portion of said insert atop said first P-type layer.
16 . The method of claim 14 further comprising placing a second N-type layer atop said first N-type layer.
17 . The method of claim 14 further comprises placing said first N-type layer over said first P-type layer and said insert.
18 . The method of claim 14 further comprising placing a second P-type layer atop said thermo-conductive layer in close proximity to said first P-type layer.
19 . The method of claim 18 further comprising:
contacting a vertical portion of said insert with said first and second P-type layers; and
placing a cross portion of said insert in contact with a top of said first and second P-type layers.
20 . The method of claim 18 further comprising placing a second N-type layer atop said first and second P-type layers and said insert.