IP Library Granted Patent US 8,480,209
Granted Patent B2
US 8,480,209 · App. 13/118,463 · Granted Jul 9, 2013

Printhead integrated circuit having connector posts encapsulated within nozzle chamber sidewalls

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Quick Facts
Patent No.
US 8,480,209
App. No.
13/118,463
Granted
Jul 9, 2013
Kind
B2
Abstract

A printhead integrated circuit includes a substrate having a plurality of inkjet nozzles assemblies formed on a surface of the substrate. The substrate contains drive circuitry for supplying power to the nozzle assemblies. Each nozzle assembly includes a nozzle chamber for containing ink, the nozzle chamber having a roof and sidewalls extending from the roof to the surface of said substrate, the roof having a nozzle opening defined therein; an actuator for ejecting ink through the nozzle opening; a pair of electrodes positioned at the surface of the substrate; and a pair of connector posts encapsulated within the sidewalls, each connector post electrically connecting a respective electrode to the actuator. Each connector post extends linearly from a respective electrode to the actuator.

Claims (24)

1. A printhead integrated circuit comprising a substrate having a plurality of inkjet nozzles assemblies formed on a surface of said substrate, said substrate containing drive circuitry for supplying power to said nozzle assemblies, each nozzle assembly comprising:

a nozzle chamber for containing ink, said nozzle chamber comprising a roof and sidewalls extending from the roof to said surface of said substrate, said roof having a nozzle opening defined therein;

an actuator for ejecting ink through said nozzle opening;

a pair of electrodes positioned at said surface of said substrate, said electrodes being electrically connected to said drive circuitry; and

a pair of connector posts encapsulated within said sidewalls, each connector post electrically connecting a respective electrode to said actuator,

wherein each connector post extends linearly from a respective electrode to said actuator.

2. The printhead integrated circuit of claim 1 , wherein each connector post is perpendicular with respect to said surface of said substrate.

3. The printhead integrated circuit of claim 1 , wherein a minimum distance between said actuator and said electrodes is at least 5 microns.

4. The printhead integrated circuit of claim 1 , wherein a minimum cross-sectional dimension of said connector posts is 2 microns or greater.

5. The printhead integrated circuit of claim 1 , wherein said nozzle assemblies are arranged in a plurality of nozzle rows, said nozzle rows extending longitudinally along said substrate.

6. The printhead integrated circuit of claim 1 , wherein said actuator is a thermal bend actuator comprising a planar active beam member mechanically cooperating with a planar passive beam member.

7. The printhead integrated circuit of claim 1 , wherein said thermal bend actuator defines, at least partially, the roof of said nozzle chamber.

8. The printhead integrated circuit of claim 6 , wherein said active beam member is electrically connected to a top of said connector posts.

9. The printhead integrated circuit of claim 8 , wherein part of said active beam member is positioned over a top of said connector posts.

10. The printhead integrated circuit of claim 6 , wherein said active beam member is comprised of vanadium-aluminium alloy.

11. The printhead integrated circuit of claim 6 , wherein said connector posts are comprised of copper.

12. The printhead integrated circuit of claim 6 , wherein said planar active beam member comprises a bent or serpentine beam element, said beam element having a first end positioned over a first connector post and a second end positioned over a second connector post, said first and second connector posts being adjacent each other.

13. The printhead integrated circuit of claim 1 , further comprising a layer of hydrophobic polymer coated on said roof.

14. A pagewidth inkjet printhead comprising one or more printhead integrated circuits circuit, each printhead integrated circuits comprising a substrate having a plurality of inkjet nozzles assemblies formed on a surface of said substrate, said substrate containing drive circuitry for supplying power to said nozzle assemblies, each nozzle assembly comprising:

a nozzle chamber for containing ink, said nozzle chamber comprising a roof and sidewalls extending from the roof to said surface of said substrate, said roof having a nozzle opening defined therein;

an actuator for ejecting ink through said nozzle opening;

a pair of electrodes positioned at said surface of said substrate, said electrodes being electrically connected to said drive circuitry; and

a pair of connector posts encapsulated within said sidewalls, each connector post electrically connecting a respective electrode to said actuator,

wherein each connector post extends linearly from a respective electrode to said actuator.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2013
From: SILVERBROOK RESEARCH PTY. LIMITED
To: ZAMTEC LIMITED
Reel/Frame 030169/0193 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2011
From: MCAVOY, GREGORY JOHN; SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 026412/0740 →