IP Library Granted Patent US 9,362,511
Granted Patent B2
US 9,362,511 · App. 13/118,556 · Granted Jun 7, 2016

Method of manufacturing a flexible electronic device and flexible device

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Quick Facts
Patent No.
US 9,362,511
App. No.
13/118,556
Granted
Jun 7, 2016
Kind
B2
Abstract

An electrical element, such as a thin-film transistor, is defined on a flexible substrate, in that the substrate is attached to a carrier by an adhesive layer, and is delaminated after definition of the transistor. This is for instance due to illumination by UV-radiation. An opaque coating is provided to protect any semiconductor material. A heat treatment is preferably given before application of the layers of the transistor to reduce stress in the adhesive layer.

Claims (16)

1. A flexible electronic device comprising:

a substrate having a first and an opposite second side;

an adhesive layer disposed on the first side of the substrate, having a reactive additive;

a thin-film electronic element disposed on the second side of the substrate; and

a coating layer disposed between the first side of the substrate and the adhesive layer, the coating layer protecting a layer of the thin-film electronic element against UV radiation;

wherein the substrate is disposed between the adhesive layer and the thin-film electronic element, and the substrate is selected from a group consisting of polyvinylchloride, polyethyleneterephtalate, and polyethylene naphthalate.

2. The flexible electronic device as claimed in claim 1 , wherein the thin-film electronic element comprises a plurality of transistors and an electro-optical layer disposed on the transistors to form a display, and at least part of the transistors function as pixel transistors of the display.

3. The flexible electronic device as claimed in claim 2 , wherein each of the transistors comprises an organic semiconductor material.

4. The flexible electronic device as claimed in claim 3 , wherein each of the transistors further comprises a source and a drain electrode mutually separated through a channel and a metallic gate electrode separated from the channel through a gate dielectric, and the metallic gate electrode is disposed between the gate dielectric and the adhesive layer.

5. The flexible electronic device as claimed in claim 2 , further comprising a protective layer disposed between the transistors and the electro-optical layer.

6. The flexible electronic device as claimed in claim 5 , wherein the protective layer is a reflective layer.

7. The flexible electronic device as claimed in claim 5 , further comprising a planarization layer disposed between the protective layer and the electro-optical layer.

8. The flexible electronic device as claimed in claim 1 , wherein the adhesive layer comprises a main polymeric component and the reactive additive is an UV-sensitive reactive additive, and the UV-sensitive reactive additive upon illumination with UV radiation will increase the glass transition temperature of the polymeric component.

9. The flexible electronic device as claimed in claim 1 , wherein the adhesive layer comprises at least one dye.

10. The flexible electronic device as claimed in claim 1 , wherein the second side of the substrate is hydrophilic and a planarization layer is disposed on the second side of the substrate.

11. The flexible electronic device as claimed in claim 1 , wherein the thin-film electronic element comprises a transistor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2016
From: CREATOR TECHNOLOGY B.V.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 038214/0991 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2011
From: POLYMER VISION LIMITED
To: CREATOR TECHNOLOGY B. V.
Reel/Frame 026684/0283 →