IP Library Granted Patent US 9,128,114
Granted Patent B2
US 9,128,114 · App. 13/119,083 · Granted Sep 8, 2015

Capacitive sensor device and a method of sensing accelerations

Inventor: Geert Langereis (Eindhoven, NL)
Assignee: NXP, B.V.
G01P15/125G01P15/0802G01P2015/0814
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Quick Facts
Patent No.
US 9,128,114
App. No.
13/119,083
Granted
Sep 8, 2015
Kind
B2
Abstract

The invention relates to a capacitive sensor device 100 . The capacitive sensor device ( 100 ) comprises a substrate ( 401 ), a first electrode ( 101 ) coupled to the substrate ( 401 , a second electrode ( 102 ) coupled to the substrate ( 401 ) and a movable element ( 103 ). The movable element ( 103 ) is capacitively coupled to the first electrode ( 101 ), the moveable element ( 103 ) and the first electrode ( 101 ) representing a first capacitor ( 104 ). The movable element ( 103 ) is capacitively coupled to the second electrode ( 102 ), the moveable element ( 103 ) and the second electrode ( 102 ) representing a second capacitor ( 105 ). The movable element ( 103 ) is movable between the first electrode ( 101 ) and the second electrode ( 102 ) in such a manner, that an electrical impedance between the first electrode ( 101 ) and the second electrode ( 102 ) is changeable due to a change of a position of the movable element ( 103 ). The movable element ( 103 ) is decoupled from the substrate ( 401 ), in particular to a signal line.

Claims (43)

1. A capacitive sensor device, the device comprising:

a silicon-on-insulator (SOI) stack including a substrate having an upper portion arranged for providing support thereon along a plane, an insulator layer on the upper portion, and a silicon layer on the insulator layer and separated from the substrate by the insulator layer;

a first electrode including a first portion of the silicon layer fixedly secured to the substrate via a first portion of the insulator layer;

a second electrode including a second portion of the silicon layer fixedly secured to the substrate via a second portion of the insulator layer; and

a movable element including a third portion of the silicon layer electrically decoupled from the substrate and including a first outer conductive portion and a second outer conductive portion laterally offset, relative to the upper portion of the plane, respectively from the first electrode and the second electrode, wherein a portion of the insulator layer between the movable element and the substrate is removed and the movable element is configured and arranged to

capacitively couple the first outer conductive portion to the first electrode and effect a first capacitance,

capacitively couple the second outer conductive portion to the second electrode to effect a second capacitance, and

move between the first electrode and the second electrode in a moving direction that is parallel to the substrate in response to an acceleration and thereby alter the first capacitance and the second capacitance due to a change of a position of the movable element;

wherein

the movable element is further configured and arranged to move, between the first electrode and the second electrode in the moving direction, in response to a range of accelerations starting at 2 g and extending up to 10 g,

movement of the movable element being unresponsive to accelerations outside of the range of accelerations, and a first distance between the first electrode and the movable element corresponds to the position of the movable element.

2. The capacitive sensor device of claim 1 , further including first and second spring elements connected to the substrate and configured and arranged to support the movable element and to enable the movable element to move between the first electrode and the second electrode in the moving direction; and wherein

the movable element is galvanically decoupled from the substrate; and

the movable element includes

a single continuous beam having a first end connected to the first spring element and a second end connected to the second spring element,

a first set of fingers extending from the single beam toward the first electrode, and

a second set of fingers extending from the single beam toward the second electrode.

3. The capacitive sensor device of claim 1 ,

wherein a second distance between the second electrode and the movable element corresponds to the position of the movable element.

4. The capacitive sensor device of claim 1 ,

wherein the first capacitance and the second capacitance are connected in series.

5. The capacitive sensor device of claim 1 ,

wherein at least one of the first capacitance and the second capacitance comprises a first partial capacitance and a second partial capacitance; and

wherein the first partial capacitance and the second partial capacitance are connected in parallel.

6. The capacitive sensor device of claim 1 ,

wherein at least a portion of the movable element and a portion of at least one of the first electrode and the second electrode interdigitate with each other.

7. The capacitive sensor device of claim 6 ,

wherein at least one of the first electrode and the second electrode comprises at least one electrode finger protruding in the direction to the movable element;

wherein the movable element comprises at least one movable finger protruding in the direction of the first electrode or in the direction of the second electrode;

wherein the at least one electrode finger and the movable finger interdigitate with each other; and

wherein the at least one electrode finger and the movable finger are capacitively coupled with each other.

8. The capacitive sensor device of claim 1 , wherein the movable element is further configured and arranged to conduct a current from the first electrode to the second electrode.

9. The capacitive sensor device of claim 1 , wherein the movable element is located in the same plane as the first electrode and the second electrode.

10. The capacitive sensor device of claim 1 , further including anchor points mounted to the substrate and spring elements connecting the movable element to the anchor points, the anchor points being configured and arranged for flexibly fixing the movable element.

11. The capacitive sensor device of claim 1 , wherein the first electrode includes a first set of electrode fingers, the second electrode includes a second set of electrode fingers, the first outer conductive portion includes a first set of conductive fingers, and the second outer conductive portion includes a second set of conductive fingers, wherein the movable element is configured and arranged to capacitively couple to the first set of electrode fingers via the first set of conductive fingers and capacitively couple to the second set of electrode fingers via the second set of conductive fingers.

12. The capacitive sensor device of claim 1 , wherein the movable element is further configured and arranged to provide a measurement of a reciprocal sum of the first capacitance and the second capacitance.

13. A capacitive sensor device for sensing accelerations, comprising:

means for capacitively coupling a first outer conductive portion of a movable element to a first electrode fixedly secured and electronically coupled a substrate of the sensor device having an upper portion arranged for providing support thereon along a plane, the movable element and the first electrode effecting a first capacitance;

means for capacitively coupling a second outer conductive portion of the movable element to a second electrode fixedly secured and electronically coupled to the substrate of the sensor device, the movable element and the second electrode effecting a second capacitance;

means for laterally moving the movable element, relative to the upper portion of the plane, between the first electrode and the second electrode in response to a range of accelerations starting at 2 g and extending up to 10 g, and in such a manner that the first capacitance and the second capacitance are altered due to a change of a position of the movable element; and

electrically decoupling the movable element from the substrate of the sensor device.

14. The capacitive sensor device of claim 13 , wherein the movable element is located in the same plane as the first electrode and the second electrode.

15. The capacitive sensor device of claim 13 , wherein the movable element is further configured and arranged to provide a measurement of a reciprocal sum of the first capacitance and the second capacitance.

Assignments (13)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
TERMINATION & LIEN RELEASE RELATED TO 039138/0001 AND 038017/0058 Recorded Jun 16, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 042859/0901 →
PATENT SALE RELEASE RELATED TO RECORDATIONS AT R/F 039138/001 AND 038017/0058 Recorded Jun 16, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 042859/0895 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2017
From: NXP B.V.
To: III HOLDINGS 12, LLC
Reel/Frame 042127/0159 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2011
From: LANGEREIS, GEERT
To: NXP, B.V.
Reel/Frame 025964/0080 →
Priority Claims (1)
EP 08105349 · Sep 15, 2008 · regional
Continuity (1)
Related Publication 20110169109A1 · Jul 14, 2011