LIGHT-EMITTING DIODE PACKAGE USING A LIQUID CRYSTAL POLYMER

1 . A light emitting diode (LED) package using a liquid crystal polymer, the package comprising:

a package main body formed by using a liquid crystal polymer;

a lead frame formed on the package main body; an LED chip mounted on the lead frame; and

a resin packaging unit encapsulating the LED chip, the resin packaging unit including phosphors.

2 . The package of claim 1 , wherein the liquid crystal polymer comprises glass fibers or mineral salts.

3 . The package of claim 1 , wherein the liquid crystal polymer comprises at least any one of TiO2, MgO, and CaCO3.

4 . The package of claim 1 , wherein the liquid crystal polymer comprises at least any one of a heat stabilizer and a light stabilizer.

5 . The package of claim 1 , further comprising:

a bonding wire electrically connecting the LED chip and the lead frame.

6 . The package of claim 1 , wherein the package main body is formed by molding a portion of the lead frame.

7 . The package of claim 6 , wherein the package main body comprises a reflective cup having a recess portion to accommodate the LED chip.

8 . The package of claim 7 , wherein the LED chip is mounted in the recess portion.

9 . The package of claim 8 , wherein the lead frame is formed on the bottom of the reflective cup.

10 . The package of claim 9 , wherein the lead frame is plated with silver (Ag).

11 . The package of claim 1 , wherein the resin packaging unit comprises one or more of blue, green, red, and yellow phosphors or may be formed to have a multi-layered structure.

12 . The package of claim 11 , wherein the resin packaging unit is made of a transparent resin.

13 . The package of claim 1 , wherein the liquid crystal polymer has 90% or more whiteness (Lx(D65)).

14 . The package of claim 1 , wherein the liquid crystal polymer has reflectance of 70% or higher, according to the wavelength in a visible region ranging from 450 nm to 780 nm.