IP Library Granted Patent US 8,593,032
Granted Patent B2
US 8,593,032 · App. 13/123,719 · Granted Nov 26, 2013

Frame-shaped MEMS piezoresistive resonator

Inventors: Kim Phan Le (Eindhoven, NL); Jozef T. M. van Beek (Rosmalen, NL)
Assignee: NXP, B.V.
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Quick Facts
Patent No.
US 8,593,032
App. No.
13/123,719
Granted
Nov 26, 2013
Kind
B2
Abstract

A novel Si MEMS piezoresistive resonator is described. The resonator has a shape of a frame, such as a ring or a polygon frame, which has two or more anchors. Electrodes located at the outer or inner rim of the resonant structure are used to excite the structure electrostatically into resonance with a desired mode shape. One or plurality of locally doped regions on the structure is used for piezoresistive readout of the signal. In the most preferred embodiments, the structure is a ring, which has four anchors, two electrodes and four piezoresistive regions at different segments of the structure. The piezoresistive regions are alternatively located at the outer rim and inner rim of the structure in such a way that the piezoresistive signals of the same sign from different regions can be collected. Advantages of this device are large readout signal, large electrode area, robustness, suppressed out-of-plane vibration and larger usable linear range.

Claims (20)

1. MEMS piezoresistive resonator, comprising:

a single piece resonator having a frame shape chosen from the group consisting of:

a circular hsape and a symmetrical polygonal shape

at least two anchors, and

at least one electrode for exciting the resonator,

wherein a resistivity of a resonator material is at at least one first location relatively high and/or wherein the resistivity of resonator material is at at least one second location relatively low.

2. MEMS piezoresistive resonator according to claim 1 , further comprising a plurality of symmetrically located anchor points.

3. MEMS piezoresistive resonator according to claim 1 , wherein the resonator includes a material that is locally N- and/or P-type doped.

4. MEMS piezoresistive resonator according to claim 1 , which resonator is divided by a plurality of anchor points into n symmetrical elements, wherein n is an even integer.

5. MEMS piezoresistive resonator according to claim 1 , wherein in a vicinity of an anchor point the resistivity of the resonator material is locally relatively low and/or wherein in a first area between a plurality of anchor points the resistivity of resonator material is relatively high and/or wherein in a second area between a plurality of anchor points the resonator material is piezoresistive.

6. Device comprising a MEMS piezoresistive resonator according to claim 1 .

7. MEMS piezoresistive resonator according to claim 1 , wherein the resonator is a silicon resonator.

8. MEMS piezoresistive resonator according to claim 1 , wherein the resonator has a form of a frame which has a shape that is one of circular, square, rectangular, hexagonal, octagonal, and decagonal.

9. Method of operating a MEMS piezoresistive resonator having a single piece resonator with a frame shape chosen from the group consisting of a circular shape and a symmetrical polygonal shape; and having at least two anchors, and at least one electrode for exciting the resonator, a resistivity of a resonator material at at least one first location being relatively high and/or the resistivity of the resonator material at at least one second location being relatively low, comprising:

applying a combination of AC and DC excitation voltages,

sending an electrical input current through the frame, and

sensing a resistance change within the frame.

10. Method according to claim 9 , wherein the resonator is operated to vibrate in a flexural mode shape.

11. Method according to claim 9 , whereby alternating segments of the resonator contract and extend at a certain point in time during operation.

12. Method of minimizing vibration energy loss by operating a resonator according to claim 9 .

Assignments (11)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2026
From: NXP B.V.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 073985/0023 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2011
From: LE PHAN, KIM; VAN BEEK, JOZEF THOMAS MARTINUS
To: NXP, B.V.
Reel/Frame 026117/0527 →
Priority Claims (1)
EP 08166565 · Oct 14, 2008 · regional
Continuity (1)
Related Publication 20110204999A1 · Aug 25, 2011