Aluminum electroplating solution and method for forming aluminum plating film
View Patent ↗An object of the present invention is to provide an extended-life plating solution that allows an aluminum electroplating process to be performed stably for a long period of time, and also a method for forming an aluminum plating film using the same. An aluminum electroplating solution according to the present invention is characterized by comprising 1.5 to 4.0 mol of an aluminum halide per 10.0 mol of dimethyl sulfone and, relative to the aluminum halide, ammonium chloride in a molar ratio of 1/15 to 1/4 or a tetraalkylammonium chloride in a molar ratio of 1/15 to 1/2. The plating solution has improved electrical conductivity and thus has a further advantage in that it allows the formation of a uniform aluminum plating film on a substrate to be plated even when the plating process is performed by a barrel method.
1. An aluminum electroplating solution comprising 1.5 to 4.0 mol of an aluminum halide per 10.0 mol of dimethyl sulfone and, relative to the aluminum halide, ammonium chloride in a molar ratio of 1/15 to 1/4 or a tetraalkylammonium chloride in a molar ratio of 1/15 to 1/2.
2. The aluminum electroplating solution according to claim 1 , characterized in that the aluminum halide is aluminum chloride.
3. The aluminum electroplating solution according to claim 1 , characterized in that the aluminum halide is an anhydride.
4. The aluminum electroplating solution according to claim 1 , characterized in that the tetraalkylammonium chloride is tetramethylammonium chloride.
5. A method for forming an aluminum plating film, comprising the steps of:
placing a substrate to be plated as a cathode in the aluminum electroplating solution according to claim 1 , and
passing an electric current through the cathode and the aluminum electroplating solution to form an aluminum plating film on a surface of the substrate to be plated.