IP Library Granted Patent US 8,573,958
Granted Patent B2
US 8,573,958 · App. 13/124,197 · Granted Nov 5, 2013

Improvements for rapid prototyping apparatus

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Quick Facts
Patent No.
US 8,573,958
App. No.
13/124,197
Granted
Nov 5, 2013
Kind
B2
Abstract

A stereolithography apparatus and an exposure system for a stereolithography apparatus, wherein light emitting diodes are used as light sources. The invention relates to aligning light from the light emitting diode and to the exchange and control of the light emitting diodes.

Claims (17)

1. A stereolithography apparatus (SA) with an exposure system (ES), said exposure system comprising:

at least one printed circuit board (PCB) with at least one socket (SO) and at least one light emitting diode (LD),

at least two spatial light modulators (SLM) with a plurality of individually controllable light-modulators,

input optics (IO) optically coupled to said spatial light modulators (SLM), output optics (OO) optically coupled to said spatial light modulators (SLM), at least one control unit (CU),

at least one light source bed (LSB) releasable locking said printed circuit board (PCB) in such a way that the optical axis of the light emitting diode (OALD) is aligned with the optical axis of said input optics (OAOP),

wherein said input optics (IO) and output optics (OO) facilitates transmission of light emitted from said light emitting diodes (LD) via said individually controllable light modulators (LM) of said spatial light modulators (SLM) to an illumination area (IA),

wherein said spatial light modulators (SLM) enable an establishment of a pattern of the light from said input optics (IO), according to control signals from said control unit (CU),

wherein said output optics (OO) enables focusing of the pattern of light from said spatial light modulators (SLM) onto an illumination area (IA),

wherein said light source bed (LSB), said exposure system (ES) or said printed circuit board (PCB) comprise an adjusting mechanism for adjusting the position of the optical axis of said at least one light emitting diode (OALD) or of the optical axis of said input optics (OAOP) after locking the printed circuit board PCB onto/into the light source bed LSB.

2. A stereolithography apparatus (SA) according to claim 1 , wherein said printed circuit board (PCB) is releasable locked to said light source bed (LSB) by means of releasable locking mechanism (RLM), and

wherein said printed circuit board (PCB) is releasable locked by means of said releasable locking mechanism (RLM) in such a way that the optical axis (OALD) of said at least one light emitting diode (LD) is coinciding with the optical axis (OAOP) of said input optics (IO).

3. A stereolithography apparatus (SA) according to claim 1 , wherein said stereolithography apparatus (SA) comprises an alarm for indicating malfunction or abnormalities in operation of the apparatus.

4. A stereolithography apparatus (SA) according to claim 1 , wherein said at least one printed circuit board (PCB) comprises cooling means (CM) comprising at least one cooling surface (CS).

5. A stereolithography apparatus (SA) according to claim 1 , wherein said releasable locking mechanism (RLM) is movable connected to said light source bed (LSB).

6. A stereolithography apparatus (SA) according to claim 1 , wherein the error of alignment of the optical axis of the light emitting diode (OALD) and the optical axis of the input optics (OAOP) is smaller than 20 μm.

7. A stereolithography apparatus (SA) according to claim 1 , wherein the number of light emitting diodes (LD) is equal to or less than the number of spatial light modulators (SLM).

8. A stereolithography apparatus (SA) according to claim 1 , wherein said apparatus comprises light guiding means for guiding light emitted from one or more of said light emitting diodes (LD) to said spatial light modulator (SLM), said light guiding means being in the form of optical fibers.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Aug 26, 2021
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: 3D SYSTEMS, INC.
Reel/Frame 057651/0374 →
SECURITY INTEREST Recorded Feb 27, 2019
From: 3D SYSTEMS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 048456/0017 →