Semiconductor light emitting device
View Patent ↗There is provided a semiconductor light emitting device including a conductive substrate, a first electrode layer, an insulating layer, a second electrode layer, a second semiconductor layer, an active layer, and a first semiconductor layer that are sequentially stacked. The contact area between the first electrode layer and the first semiconductor layer is 3% to 13% of the total area of the semiconductor light emitting device, and thus high luminous efficiency is achieved.
1. A semiconductor light emitting device, comprising:
a conductive substrate;
a light emitting structure having a second semiconductor layer, an active layer, and a first semiconductor layer sequentially stacked;
a first electrode layer disposed between the conductive substrate and the light emitting structure, the first electrode layer extending toward an upper surface of the light emitting structure through contact holes to be in contact with an inside of the first semiconductor layer, the contact holes penetrating the second semiconductor layer and the active layer, and the first electrode layer extending toward a side surface of the light emitting structure through an electrical connection portion to be exposed outwardly of the light emitting structure; and
an insulating layer electrically separating the first electrode layer from the conductive substrate, the second semiconductor layer and the active layer, wherein:
a contact area between the contact holes and the first semiconductor layer is 0.615% to 15.68% of a total area of the upper surface of the light emitting structure, and
the first electrode layer has a substantially flat shape except for a region in which the contact holes are disposed.
2. The semiconductor light emitting device of claim 1 , wherein the contact holes are uniformly arranged.
3. The semiconductor light emitting device of claim 1 , wherein the number of the contact holes is 1 to 48,000.
4. The semiconductor light emitting device of claim 1 , wherein the contact area between the first electrode layer and the first semiconductor layer is 6,150 μm 2 to 156,800 μm 2 per 1,000,000 μm 2 area of the upper surface of the semiconductor light emitting device.
5. The semiconductor light emitting device of claim 2 , wherein a distance between central points of adjacent contact holes among the contact holes is 5 μm to 500 μm.
6. The semiconductor light emitting device of claim 1 , wherein the contact area between the first electrode layer and the first semiconductor layer is 3% to 13% of a total area of the upper surface of the light emitting structure.
7. The semiconductor light emitting device of claim 1 , wherein the second electrode layer includes one selected from the group consisting of Ag, Al, Pt, Ni, Pt, Pd, Au, Ir and a transparent conductive oxide.
8. The semiconductor light emitting device of claim 1 , wherein the conductive substrate includes one selected from the group consisting of Au, Ni, Al, Cu, W, Si, Se, and GaAs.