Semiconductor light-emitting element, method of manufacturing same, and light-emitting device
View Patent ↗A semiconductor light-emitting element, a method of manufacturing same, and a light-emitting device enabling an increase in light emission efficiency is provided. The semiconductor light-emitting element 1 in accordance with the present invention includes: a light-emitting layer 2 having a laminated structure in which a p-type GaN film 24 and an n-type GaN film 22 are included; a conductive hexagonal pyramidal base 3 formed from ZnO and mounting with the light-emitting layer on a bottom surface 31 ; an anode 5 joined to the bottom surface 31 of the base 3 at a position apart from the light-emitting layer 2 ; and a cathode 4 mounted on the light-emitting layer 2 . In the semiconductor light-emitting element 1 , the p-type GaN film 24 is joined to the bottom surface 31 of the base 3 , and the cathode 4 is joined to an N-polar plane of the n-type GaN film 22 , said N-polar plane of the n-type GaN film 22 being an opposite side to the p-type GaN film 24 . In the semiconductor light-emitting element 1 , the N-polar plane of the n-type GaN film 22 has a fine peak-valley structure 22 c outside a portion joined to the cathode 4.
1. A semiconductor light-emitting element, comprising:
a light-emitting layer having a laminated structure in which a p-type GaN film and an n-type GaN film are included;
a conductive hexagonal pyramidal base formed from ZnO and mounted with the light-emitting layer on a bottom surface thereof;
an anode joined to the bottom surface of the base at a position apart from the light-emitting layer; and
a cathode mounted on the light-emitting layer,
wherein
the p-type GaN film is joined to the bottom surface of the base,
the cathode is joined to an N-polar plane of the n-type GaN film, said N-polar plane being an opposite side to the p-type GaN film, and
the N-polar plane of the n-type GaN film has a fine peak-valley structure outside a portion joined to the cathode, said N-polar plane being said opposite side to the p-type GaN film.
2. The semiconductor light-emitting element according to claim 1 , wherein the fine peak-valley structure is composed of a plurality of recesses arranged two-dimensionally over the N-polar plane of the n-type GaN.
3. The semiconductor light-emitting element according to claim 2 , wherein an opening diameter of each of the recesses gradually increases toward the N-polar plane side of the n-type GaN film.
4. The semiconductor light-emitting element according to claim 3 , wherein each of the recesses has a pyramidal shape.
5. The semiconductor light-emitting element according to claim 1 , wherein the cathode and the anode are composed of a laminated film selected from: a laminated film of a Ti film, an Al film, and a Au film; a laminated film of a Ti film and a Au film; a laminated film of an Al film and a Au film; and a laminated film of a Ti film, an Al film, a Ni film, and a Au film.
6. A method of manufacturing a semiconductor light-emitting element, in which
a light-emitting layer having a laminated structure of a p-type GaN film and an n-type GaN film is formed;
the p-type GaN film of the light-emitting layer is joined to a bottom surface of a hexagonal pyramidal base formed from ZnO;
an anode is joined to the bottom surface of the base at a position apart from the light-emitting layer;
a cathode is joined to an N-polar plane of the n-type GaN film, said N-polar plane of the n-type GaN film being an opposite side to the p-type GaN film; and
a fine peak-valley structure is formed on the N-polar plane of the n-type GaN film outside a portion joined to the cathode, said N-polar plane of the n-type GaN film being said opposite side to the p-type GaN film,
the method comprising:
forming a transfer layer on the N-polar plane of the n-type GaN film;
pressing a mold die having a predetermined peak-valley pattern on one surface thereof against the transfer layer and transferring the peak-valley pattern to the transfer layer; and
dry etching the transfer layer and the n-type GaN layer from surface side and etching out the transfer layer and part of the N-polar plane of the n-type GaN layer, whereby the fine peak-valley structure is formed on the N-polar plane of the n-type GaN film.
7. A light-emitting device, comprising:
the semiconductor light-emitting element according to claim 1 ;
a mounting substrate mounted with the semiconductor light-emitting element on one surface side thereof; and
a light conversion member that is formed from a transparent material including a fluorescent material excited by light emitted from the semiconductor light-emitting element and emits light having a wavelength longer than that of the semiconductor light-emitting element, said light conversion member being formed in a dome-shape and being provided so as to surround the semiconductor light-emitting element between the mounting substrate and the light conversion member,
wherein the mounting substrate is provided, on said one surface side thereof, with: a plurality of wiring patterns connected separately from each other by bumps to the cathode and the anode of the semiconductor light-emitting element; and a reflective film that reflects light emitted from the semiconductor light-emitting element towards the mounting substrate side.
8. The semiconductor light-emitting element according to claim 2 , wherein the cathode and the anode are composed of a laminated film selected from: a laminated film of a Ti film, an Al film, and a Au film; a laminated film of a Ti film and a Au film; a laminated film of an Al film and a Au film; and a laminated film of a Ti film, an Al film, a Ni film, and a Au film.
9. The semiconductor light-emitting element according to claim 3 , wherein the cathode and the anode are composed of a laminated film selected from: a laminated film of a Ti film, an Al film, and a Au film; a laminated film of a Ti film and a Au film; a laminated film of an Al film and a Au film; and a laminated film of a Ti film, an Al film, a Ni film, and a Au film.
10. The semiconductor light-emitting element according to claim 4 , wherein the cathode and the anode are composed of a laminated film selected from: a laminated film of a Ti film, an Al film, and a Au film; a laminated film of a Ti film and a Au film; a laminated film of an Al film and a Au film; and a laminated film of a Ti film, an Al film, a Ni film, and a Au film.
11. A light-emitting device, comprising:
the semiconductor light-emitting element according to claim 2 ;
a mounting substrate mounted with the semiconductor light-emitting element on one surface side thereof; and
a light conversion member that is formed from a transparent material including a fluorescent material excited by light emitted from the semiconductor light-emitting element and emits light having a wavelength longer than that of the semiconductor light-emitting element, said light conversion member being formed in a dome-shape and being provided so as to surround the semiconductor light-emitting element between the mounting substrate and the light conversion member,
wherein the mounting substrate is provided, on said one surface side thereof, with: a plurality of wiring patterns connected separately from each other by bumps to the cathode and the anode of the semiconductor light-emitting element; and a reflective film that reflects light emitted from the semiconductor light-emitting element towards the mounting substrate side.
12. A light-emitting device, comprising:
the semiconductor light-emitting element according to claim 3 ;
a mounting substrate mounted with the semiconductor light-emitting element on one surface side thereof; and
a light conversion member that is formed from a transparent material including a fluorescent material excited by light emitted from the semiconductor light-emitting element and emits light having a wavelength longer than that of the semiconductor light-emitting element, said light conversion member being formed in a dome-shape and being provided so as to surround the semiconductor light-emitting element between the mounting substrate and the light conversion member,
wherein the mounting substrate is provided, on said one surface side thereof, with: a plurality of wiring patterns connected separately from each other by bumps to the cathode and the anode of the semiconductor light-emitting element; and a reflective film that reflects light emitted from the semiconductor light-emitting element towards the mounting substrate side.
13. A light-emitting device, comprising:
the semiconductor light-emitting element according to claim 4 ;
a mounting substrate mounted with the semiconductor light-emitting element on one surface side thereof; and
a light conversion member that is formed from a transparent material including a fluorescent material excited by light emitted from the semiconductor light-emitting element and emits light having a wavelength longer than that of the semiconductor light-emitting element, said light conversion member being formed in a dome-shape and being provided so as to surround the semiconductor light-emitting element between the mounting substrate and the light conversion member,
wherein the mounting substrate is provided, on said one surface side thereof, with: a plurality of wiring patterns connected separately from each other by bumps to the cathode and the anode of the semiconductor light-emitting element; and a reflective film that reflects light emitted from the semiconductor light-emitting element towards the mounting substrate side.