Cable for high-voltage electronic device
View Patent ↗A cable for a high-voltage electronic device having a small diameter and an excellent voltage resistance characteristic. The cable includes an inner semiconducting layer, a high-voltage insulator, an outer semiconducting layer, a shielding layer, and a sheath on an outer periphery of a cable core portion, wherein the high-voltage insulator is formed of an insulating composition containing 0.5 to 5 parts by mass of an inorganic filler with respect to 100 parts by mass of an olefin-based polymer, and the inorganic filler has an average dispersed-particle diameter of 1 μm or less.
1. An X-ray machine cable, comprising:
a cable core portion; and
an inner semiconducting layer;
a high-voltage insulator;
an outer semiconducting layer;
a shielding layer; and
a sheath sequentially formed on an outer periphery of a cable core portion,
wherein the high-voltage insulator is formed of an insulating composition containing 0.5 to 5 parts by mass of an inorganic filler and 100 parts by mass of ethylene-propylene-diene copolymer, the inorganic filler consisting of fumed silica, the fumed silica dispersed as particles having an average dispersed-particle diameter of 0.5 to 0.9 μm in the insulator, and
wherein the cable has an outside diameter of about 13 to about 14 mm.
2. The cable according to claim 1 , wherein the ethylene-propylene-diene copolymer is chemically crosslinked with a crosslinking agent.
3. The cable according to claim 2 , wherein the crosslinking degree is 50% or more at a gel fraction as measured according to JIS C 3005.
4. The cable according to claim 2 , wherein the crosslinking agent is dicumyl peroxide.
5. The cable according to claim 1 , wherein the composition consists of the fumed silica, the ethylene-propylene-diene copolymer, and a crosslinking agent.
6. The cable according to claim 5 , wherein the crosslinking agent is dicumyl peroxide.
7. The cable according to claim 1 , wherein the high-voltage insulator is formed of an insulating composition containing 0.5 to 2 parts by mass of the inorganic filler.