Optoelectronic projection device

1. An optoelectronic projection device which generates a predefined image during operation, comprising a semiconductor body having an active layer that generates electromagnetic radiation and a radiation exit side and is an imaging element of the projection device,

wherein

to electrically contact the semiconductor body, a first contact layer and a second contact layer are arranged at a rear side of the semiconductor body, the rear side lying opposite the radiation exit side, and are electrically insulated from one another by a separating layer,

partial regions of the first contact layer are led through openings in the second contact layer and through the active layer in a direction toward the radiation exit side,

the semiconductor body is structured to form a pattern so that only a part of the semiconductor body is removed in first areas,

the first are located between radiation emitting second areas and the pattern is generated during operation of the projection device by the radiation emitting second areas,

the second contact layer is in the form of pixels, and

at least one part of the predefined image arises as a result of projection of at least part of the pixels and of at least part of the pattern during operation of the projection device.

2. The optoelectronic projection device according to claim 1 , wherein the pixels are arranged in a two-dimensional segment display.

3. The optoelectronic projection device according to claim 1 , wherein the pixels are arranged in a two-dimensional regular matrix composed of n rows and m columns.

4. The optoelectronic projection device according to claim 1 , wherein the first contact layer is arranged at a side of the second contact layer remote from the semiconductor body, the second contact layer has a plurality of openings, and the first contact layer runs through the openings to the semiconductor body.

5. The optoelectronic projection device according to claim 1 , wherein a partial region of the first contact layer extends from the rear side through a perforation in the active layer in a direction toward the radiation exit side.

6. The optoelectronic projection device according to claim 1 , wherein the first contact layer has at least one electrical connection region that electrically contacts the semiconductor body at a side of the active layer which faces the radiation exit side.

7. The optoelectronic projection device according to claim 1 , wherein the first contact layer has a plurality of electrical connection regions electrically conductively connected to a connection region.

8. The optoelectronic projection device according to claim 1 , wherein the second contact layer is in the form of pixels and has a plurality of electrical connection pads, wherein a pixel is in each case electrically conductively connected to a connection pad.

9. The optoelectronic projection device according to claim 1 , wherein radiation coupling-out structures are arranged in regions on the radiation exit side.

10. The optoelectronic projection device according to claim 1 , wherein an optical element is disposed downstream of the semiconductor body on the radiation exit side.

11. The optoelectronic projection device according to claim 1 , wherein the first and/or the second contact layer reflect(s) part of the electromagnetic radiation, said part being emitted from the active layer in a direction toward the rear side and in a direction of the radiation exit side.

12. The optoelectronic projection device according to claim 1 , wherein the projection device is part of an electronic component selected from the group consisting of a mobile telephone, PDA, laptop, computer, clock and alarm clock.

13. A method of producing an optoelectronic projection device that generates a predefined image during operation comprising:

providing a single semiconductor body having an active layer that generates electromagnetic radiation and a radiation exit side and is an imaging element of the projection device,

applying a first contact layer and a second contact layer at a rear side of the semiconductor body, the rear side lying opposite the radiation exit side, the first and second contact layers are electrically insulated from one another by separating layer and are adapted to electrically contact the semiconductor body, and

structuring the semiconductor body to form a pattern for the predefined image so that at least a part of the semiconductor body is removed in first areas, the structuring by etching and lithography,

wherein

the first areas are located between radiation emitting second areas and the pattern is generated during operation of the projection device by the radiation emitting second areas,

partial regions of the first contact layer are led through openings in the second contact layer and through the active layer in a direction towards the radiation exit side,

the second contact layer is in the form of pixels, and

at least one part of the predefined image arises as a result of projection of at least part of the pixels and of at least part of the pattern during operation of the projection device.

14. the method accordingly to claim 13 , wherein the semiconductor body is completely removed in the first areas such that in the first areas electrically insulating regions of the second contact layer arranged between the pixels are not covered with the semiconductor body, radiation coupling-out structures are arranged on the radiation exit side in the second areas below which the pixels of the second contact layer are arranged in a vertical direction, and the active layer of the semiconductor body comprises InGaAlP or InGaN.