METAL STABILIZERS FOR EPOXY RESINS
A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.
1 . A composition comprising:
a) an epoxy resin;
b) a hardener; and
c) a stabilizer comprising a metal-containing compound, said metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof,
wherein said composition is prepared from a halogen-containing compound.
2 . A composition in accordance with claim 1 wherein said stabilizer is present in an amount in the range of from about 0.1 weight percent to about 20 weight percent, based on the total weight of said composition.
3 . A composition in accordance with claim 1 further comprising a solvent in an amount in the range of from 0.5 to 95 wt %.
4 . A composition in accordance with claim 1 further comprising inert fillers selected from the group consisting of talc, silica, alumina, and combinations thereof.
5 . A composition in accordance with claim 1 wherein said halogen-containing compound is a bromine-containing compound.
6 . A composition in accordance with claim 5 wherein said bromine-containing compound is a brominated polyphenol.
7 . A composition in accordance with claim 6 wherein said brominated polyphenol is selected from the group consisting of tetrabromobisphenol-A (TBBA) and tetrabromobisphenol F.
8 . A composition in accordance with claim 1 wherein said epoxy resin is produced by contacting a glycidyl ether with a bisphenol compound to form oxazolidinone moieties.
9 . A composition in accordance with claim 8 wherein said epoxy resin is produced by contacting a glycidyl ether with a bisphenol compound and a polyisocyanate.
10 . A composition in accordance with claim 8 wherein said bisphenol compound is bisphenol A.
11 . A composition in accordance with claim 8 wherein said bisphenol compound is tetrabromobisphenol A.
12 . A composition in accordance with claim 1 wherein said metal is zinc.
13 . A composition in accordance with claim 12 wherein said metal containing compound is selected from the group consisting of a zinc salt, zinc hydroxide, zinc oxide, zinc acetylacetonate, an organic zinc compound and combinations of any two or more thereof.
14 . A composition in accordance with claim 13 wherein said metal containing compound is zinc oxide.
15 . A composition in accordance with claim 14 wherein said zinc oxide is formed by addition of a zinc oxide precursor to said epoxy resin.
16 . A composition in accordance with claim 15 wherein said zinc oxide precursor is zinc phenate.
17 . A composition in accordance with claim 13 wherein said metal containing compound is zinc dimethyldithiocarbamate.
18 . A composition in accordance with claim 1 wherein said epoxy resin is selected from the group consisting of a phenolic resin, a benzoxazine resin, an aryl cyanate resin, an aryl triazine resin, a maleimide resin, and combinations of any two or more thereof.
19 . A composition in accordance with claim 1 wherein said composition has at least one nucleophilic nitrogen source wherein a dative bond is formed between said metal and said nucleophilic nitrogen source.
20 . A composition in accordance with claim 19 wherein said at least one nucleophilic nitrogen source is selected from the group consisting of an imidazole, an oxazolidinone, dicyandiamide and combinations thereof.
21 . A varnish produced from the composition of claim 1 .
22 . A prepreg prepared from the varnish of claim 21 .
23 . An electrical laminate prepared from the varnish of claim 21 .
24 . A coating prepared from the varnish of claim 21 .
25 . A composite prepared from the varnish of claim 21 .
26 . A casting prepared from the varnish of claim 21 .
27 . An adhesive prepared from the varnish of claim 21 .