IP Library Granted Patent US 8,513,775
Granted Patent B2
US 8,513,775 · App. 13/131,614 · Granted Aug 20, 2013

CdTe semiconductor substrate for epitaxial growth and substrate container

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,513,775
App. No.
13/131,614
Granted
Aug 20, 2013
Kind
B2
Abstract

Provided is a CdTe-based semiconductor substrate for epitaxial growth, which is capable of growing good-quality epitaxial crystals without urging a substrate user to implement etching treatment before the epitaxial growth. A CdTe-based semiconductor substrate, in which tracks of linear polishing damage with a depth of 1 nm or more are not observed within a viewing range of 10 μm×10 μm when a surface of the substrate is observed by an atomic force microscope, and orange peel defects are not observed when the surface of the substrate is visually observed under a fluorescent lamp, can grow the good-quality epitaxial crystals.

Claims (21)

1. A CdTe-based semiconductor substrate for epitaxial growth, wherein a track of a linear polishing damage with a depth of 1 nm or more is not observed within a viewing range of 10 μm×10 μm when a surface of the substrate is observed by an atomic force microscope, and an orange peel defect is not observed when the surface of the substrate is visually observed under a fluorescent lamp.

2. The CdTe-based semiconductor substrate for epitaxial growth according to claim 1 ,

wherein the surface of the substrate is subjected to predetermined polishing treatment, etching treatment responding to the polishing, and washing and drying treatment;

wherein the substrate is subsequently stored for 24 hours to 36 hours in a clean booth of Class 100;

wherein the substrate is subsequently subjected to light etching treatment with a light etching amount of 0.1 μm or more to 1 μm or less, and washing and drying treatment;

wherein the substrate is subsequently stored for 6 hours to 36 hours in the clean booth of Class 100 one more time; and

wherein the substrate is subsequently housed in a substrate container with a nitrogen gas atmosphere.

3. The CdTe-based semiconductor substrate for epitaxial growth according to claim 2 , wherein a deterioration in a thickness variation in the surface of the substrate due to the etching treatment is 0.4 μm or less.

4. A substrate container, which houses a substrate casing in a nitrogen gas atmosphere, the substrate casing housing the CdTe-based semiconductor substrate for epitaxial growth according to claim 1 .

5. A CdTe-based semiconductor substrate for epitaxial growth, wherein at least one viewing range of 10 μm×10 μm, in which a track of a linear polishing damage with a depth of 1 nm or more is not observed, exists on a surface of the substrate observed by an atomic force microscope, and an orange peel defect is not observed when the surface of the substrate is visually observed under a fluorescent lamp.

6. The CdTe-based semiconductor substrate for epitaxial growth according to claim 5 ,

wherein the surface of the substrate is subjected to a predetermined polishing treatment, a first etching treatment responding to the polishing, and washing and drying treatment;

wherein the substrate is subsequently stored for a first predetermined time in a clean booth;

wherein the substrate is subsequently subjected to a second etching treatment, and washing and drying treatment; and

wherein the substrate is subsequently stored for a second predetermined time in the clean booth.

7. The CdTe-based semiconductor substrate for epitaxial growth according to claim 6 , wherein a deterioration in a thickness variation in the surface of the substrate due to the first etching treatment is 0.4 μm or less.

8. The CdTe-based semiconductor substrate for epitaxial growth according to claim 6 , wherein the second etching treatment is a light etching amount of 0.1 μm or more to 1 μm or less.

9. The CdTe-based semiconductor substrate for epitaxial growth according to claim 6 , wherein the first predetermined time is 24 hours to 36 hours.

10. The CdTe-based semiconductor substrate for epitaxial growth according to claim 6 , wherein the second predetermined time is 6 hours to 36 hours.

11. The CdTe-based semiconductor substrate for epitaxial growth according to claim 6 , wherein the substrate is housed in a substrate container with a nitrogen gas atmosphere after the storing for the second predetermined time in the clean booth.

12. A substrate container, which houses a substrate casing in a nitrogen gas atmosphere, the substrate casing housing the CdTe-based semiconductor substrate for epitaxial growth according to claim 5 .

Assignments (2)
CHANGE OF ADDRESS OF ASSIGNEE Recorded Jun 2, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 042669/0315 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2011
From: SUZUKI, KENJI; TANIGUCHI, HIDEYUKI; KURITA, HIDEKI; HIRANO, RYUICHI
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 026362/0278 →