HOMOGENEOUS BISMALEIMIDE - TRIAZINE - EPOXY COMPOSITIONS USEFUL FOR THE MANUFACTURE OF ELECTRICAL LAMINATES
Homogeneous solutions including an epoxy resin, a maleimide component including at least one bismaleimide, and a cyanate ester component are disclosed. Such compositions may be useful, for example, in curable compositions, thermoset compositions, and the manufacture of electrical laminates and other end products that may be formed from or using the curable and thermoset compositions.
1 . A process for forming a curable composition, comprising:
admixing an epoxy resin and a maleimide component comprising at least one bismaleimide at a temperature in the range from about 50° C. to about 250° C.;
admixing a cyanate ester component with the epoxy-maleimide admixture to form a homogeneous solution.
2 . The process of claim 1 , wherein the maleimide component comprises a phenyl maleimide and a 4,4′-bismaleimido-diphenylmethane.
3 . The process of claim 2 , wherein a weight ratio of the phenyl maleimide to the 4,4-bismaleimido-diphenylmethane is in the range from 95:5 to 5:95.
4 . The process of claim 2 , wherein a weight ratio of the phenyl maleimide to the 4,4′-bismaleimido-diphenylmethane is in the range from 25:75 to 75:25.
5 . The process of claim 2 , wherein a weight ratio of the phenyl maleimide to the 4,4′-bismaleimido-diphenylmethane is in the range from 65:35 to 35:65.
6 . The process of claim 1 , wherein the cyanate ester component comprises at least one of a cyanate ester and a partially trimerized cyanate ester.
7 . The process of claim 1 , wherein a molar ratio of the maleimide component to the epoxy resin to the cyanate ester component in the homogeneous solution is in the range from 90:5:5 to 5:90:5 to 5:5:90, wherein the molar ratio is based on the functional groups of the respective components.
8 . The process of claim 1 , wherein a molar ratio of the maleimide component to the epoxy resin to the cyanate ester component in the homogeneous solution is in the range from 30:20:50 to 50:30:20 to 20:50:30, wherein the molar ratio is based on the functional groups of the respective components.
9 . A curable composition, comprising:
a maleimide component comprising at least one bismaleimide;
a cyanate ester component; and
an epoxy resin;
wherein the curable composition is a homogeneous solution.
10 . The curable composition of claim 9 , wherein the maleimide component comprises a phenyl maleimide and a 4,4′-bismaleimido-diphenylmethane.
11 . The curable composition of claim 10 , wherein a weight ratio of the phenyl maleimide to the 4,4′-bismaleimido-diphenylmethane is in the range from 95:5 to 5:95.
12 . The composition of claim 10 , wherein a weight ratio of the phenyl maleimide to the 4,4′-bismaleimido-diphenylmethane is in the range from 25:75 to 75:25.
13 . The composition of claim 9 , wherein the cyanate ester component comprises at least one of a cyanate ester and a partially trimerized cyanate ester.
14 . The composition of claim 9 , wherein a molar ratio of the maleimide component to the epoxy resin to the cyanate ester component in the homogeneous solution is in the range from 90:5:5 to 5:90:5 to 5:5:90, wherein the molar ratio is based on the functional groups of the respective components.
15 . The composition of claim 9 , wherein a molar ratio of the maleimide component to the epoxy resin to the cyanate ester component in the homogeneous solution is in the range from 30:20:50 to 50:30:20 to 20:50:30, wherein the molar ratio is based on the functional groups of the respective components.
16 . The curable composition of claim 9 , wherein the composition remains as a homogeneous solution for at least twenty-eight days, where solution stability is measured using a Gardener bubble viscometer.
17 . A lacquer for use in electrical laminates comprising the curable composition as claimed in claim 9 .
18 . A thermoset composition, comprising: a reaction product of a homogeneous curable composition comprising a cyanate ester, an epoxy resin, and a maleimide component comprising at least one bismaleimide.
19 . The thermoset composition of claim 18 , wherein the maleimide component comprises a phenyl maleimide and a 4,4′-bismaleimido-diphenylmethane.
20 . The thermoset composition of claim 19 , wherein a weight ratio of the phenyl maleimide to the 4,4′-bismaleimido-diphenylmethane is in the range from 95:5 to 5:95.
21 . The thermoset composition of claim 19 , wherein a weight ratio of the phenyl maleimide to the 4,4′-bismaleimido-diphenylmethane is in the range from 25:75 to 75:25.
22 . The thermoset composition of claim 18 , wherein the cyanate ester component comprises at least one of a cyanate ester and a partially trimerized cyanate ester.
23 . The thermoset composition of claim 18 , wherein a molar ratio of the maleimide component to the epoxy resin to the cyanate ester component in the homogeneous solution is in the range from 90:5:5 to 5:90:5 to 5:5:90, wherein the molar ratio is based on the functional groups of the respective components.
24 . The thermoset composition of claim 18 , wherein a molar ratio of the maleimide component to the epoxy resin to the cyanate ester component in the homogeneous solution is in the range from 30:20:50 to 50:30:20 to 20:50:30, wherein the molar ratio is based on the functional groups of the respective components.
25 . The thermoset composition of claim 18 , wherein the thermoset composition has:
a glass transition temperature, as measured by differential scanning calorimetry, of at least 210° C.; and
a 5% decomposition temperature, as measured using thermal gravimetric analyses, of at least 300° C.
26 . A composite comprising the thermoset composition as claimed in claim 18 .
27 . A process for forming a composite, comprising:
impregnating a first substrate with a curable composition, wherein the curable composition comprises:
a maleimide component comprising at least one bismaleimide;
a cyanate ester component; and
an epoxy resin;
wherein the curable composition is a homogeneous solution;
at least partially curing the curable composition to form a prepreg;
disposing the prepreg on a second substrate; and
curing the prepreg to form an electrical laminate.
28 . The process of claim 27 , wherein the second substrate is electrically conductive.
29 . The process of claim 27 , further comprising:
admixing the epoxy resin and the maleimide component comprising at least one bismaleimide at a temperature in the range from about 50° C. to about 250° C.;
admixing the cyanate ester component with the epoxy-maleimide admixture to form the curable composition.
30 . The process of claim 27 , wherein the curable composition, upon curing, has:
a glass transition temperature, as measured by differential scanning calorimetry, of at least 210° C.; and
a 5% decomposition temperature, as measured using thermal gravimetric analyses, of at least 300° C.