IP Library Granted Patent US 8,287,987
Granted Patent B1
US 8,287,987 · App. 13/134,742 · Granted Oct 16, 2012

Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape

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Quick Facts
Patent No.
US 8,287,987
App. No.
13/134,742
Granted
Oct 16, 2012
Kind
B1
Abstract

A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.

Claims (46)

1. A ballistic-resistant panel comprising:

a metallic strike-face;

a backing including a plurality of interleaved layers of non-fibrous ultra high molecular weight polyethylene (UHMWPE) tape; and

said UHMWPE tape including a tensile modulus of at least 1,400 grams per denier.

2. The ballistic-resistant panel of claim 1 wherein said metallic strike-face includes a layer of high hardness steel and a layer of aluminum.

3. The ballistic-resistant panel of claim 2 wherein

said layer of high hardness steel is 0.25 inch thick;

said layer of aluminum is 1.5 inches thick; and

said aluminum is grade 6061 aluminum.

4. The ballistic-resistant panel of claim 1 wherein said backing includes an areal density of 1.6 pounds per square foot.

5. The ballistic-resistant panel of claim 1 wherein said UHMWPE tape includes

strips of tape having a width of at least 1.0 inch;

a viscosity-average molecular weight of at least 2,000,000; and

a thickness of between 0.0015 and 0.004 inch.

6. The ballistic-resistant panel of claim 1 including an adhesive on at least one side of said interleaved layers of said non-fibrous UHMWPE tape.

7. A ballistic-resistant panel comprising:

a metallic strike-face;

a backing including a first portion and a second portion;

said first portion consisting of a plurality of interleaved layers of non-fibrous ultra high molecular weight polyethylene (UHMWPE) tape; and

said second portion consisting of a plurality of interleaved layers of cross-plied fibers embedded in resin.

8. The ballistic-resistant panel of claim 7 wherein said UHMWPE tape includes a tensile modulus of at least 1,400 grams per denier.

9. The ballistic-resistant panel of claim 7 wherein said metallic strike-face includes a layer of high hardness steel and a layer of aluminum.

10. The ballistic-resistant panel of claim 7 wherein

said layer of high hardness steel is 0.25 inch thick; and

said layer of aluminum is 1.0 inch thick.

11. The ballistic-resistant panel of claim 7 wherein said aluminum is grade 6061 aluminum.

12. The ballistic-resistant panel of claim 7 wherein said backing includes an areal density of at least 2.5 pounds per square foot.

13. The ballistic-resistant panel of claim 7 wherein said UHMWPE tape includes

strips of tape having a width of at least 1.0 inch;

a viscosity-average molecular weight of at least 2,000,000; and

a thickness of between 0.0015 and 0.004 inch.

14. The ballistic-resistant panel of claim 13 wherein said tape strips include a width to thickness ratio of at least 400:1 and a denier of 6,000 or greater.

15. A ballistic-resistant panel comprising:

a plurality of layers of non-fibrous ultra high molecular weight polyethylene (UHMWPE) tape;

each of said layers of non-fibrous UHMWPE tape including a plurality of monolithic tape strips woven together to form a woven layer;

said non-fibrous UHMWPE tape strips including a modulus of greater than 1,400 grams per denier;

said plurality of woven layers of non-fibrous UHMWPE tape molded together by heat and pressure.

16. The ballistic-resistant panel of claim 15 wherein said ballistic-resistant panel includes an areal density of 2.2 pounds per square foot.

17. The ballistic-resistant panel of claim 15 wherein

each of said woven layers are interleaved with a low density polyethylene film, said low density polyethylene film acting as a binder for binding together said woven tape strips upon application of heat and pressure; and

said low density polyethylene film is 18-microns thick.

18. The ballistic-resistant panel of claim 15 wherein said non-fibrous UHMWPE tape includes

a viscosity-average molecular weight of at least 2,000,000;

a width of at least 1.0 inch; and

a thickness of between 0.0015 and 0.004 inch.

19. The ballistic-resistant panel of claim 15 wherein said heat of molding is 250 degrees F. and said pressure is 500 psi.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT SAFETY & CONSTRUCTION, INC.
Reel/Frame 049585/0450 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2012
From: BAE SYSTEMS TENSYLON HIGH PERFORMANCE MATERIALS INC.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 029084/0043 →
CHANGE OF NAME Recorded Aug 27, 2011
From: TENSYLON HIGH PERFORMANCE MATERIALS, INC.
To: BAE SYSTEMS TENSYLON HIGH PERFORMANCE MATERIALS, INC.
Reel/Frame 026818/0071 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2011
From: LYONS, FIELDER STANTON; MEARS, JEFFREY A.; WEEDON, GENE C.; HARDING, KENNETH C.; OWEN, LISA; RUSSELL, PETER ANTHONY; MITCHELL, JOSEPH
To: TENSYLON HIGH PERFORMANCE MATERIALS, INC.
Reel/Frame 026798/0833 →