Organic light-emitting display device and input pad thereof
View Patent ↗An organic light-emitting display device includes a plurality of pixels on a substrate, and input pads coupled to the plurality of pixels through wirings, the input pads being connected to a circuit board, wherein each of the input pads includes an extension portion extending from a respective wiring, a connection portion separated from the extension portion by a predetermined distance and connected to the circuit board, a resistance portion contacting the extension portion and the connection portion, and a dummy portion on the resistance portion and contacting the connection portion, the dummy portion being insulated from the extension portion.
1. An organic light-emitting display device, comprising:
a plurality of pixels on a substrate; and
input pads coupled to the plurality of pixels through wirings, the input pads being connected to a circuit board, wherein each of the input pads includes:
an extension portion extending from a respective wiring,
a connection portion separated from the extension portion by a predetermined distance and connected to the circuit board,
a resistance portion, directly disposed on a surface of a substrate of the input pads, contacting the extension portion and the connection portion, and
a dummy portion on the resistance portion and contacting the connection portion, the dummy portion being insulated from the extension portion, wherein the dummy portion has a larger electrical conductivity than that of the resistance portion, wherein the dummy portion is on top of the resistance portion.
2. The organic light-emitting display device as claimed in claim 1 , further comprising
an insulating layer on the dummy portion,
wherein the resistance portion contacts the extension portion through first contact holes in the insulating layer and contacts the connection portion through second contact holes in the insulating layer, and wherein the dummy portion contacts the connection portion through third contact holes in the insulating layer.
3. The organic light-emitting display device as claimed in claim 2 , wherein each of the first contact holes corresponds to a first edge portion of the resistance portion, each of the second contact holes corresponds to a second edge portion of the resistance portion, and the first and second edge portions of the resistance portion being opposite each other.
4. The organic light-emitting display device as claimed in claim 3 , wherein the first contact holes are adjacent to each other along a direction in which the first edge portion extends, and the second contact holes are adjacent to each other along a direction in which the second edge portion extends.
5. The organic light-emitting display device as claimed in claim 4 , wherein the third contact holes are disposed between the first contact holes and the second contact holes, the third contact holes being adjacent to the second contact holes.
6. The organic light-emitting display device as claimed in claim 5 , wherein the third contact holes are adjacent to each other along a direction in which either the first edge portion or the second edge portion extends.
7. The organic light-emitting display device as claimed in claim 1 , wherein the resistance portion includes polysilicon.
8. The organic light-emitting display device as claimed in claim 1 , wherein the dummy portion includes metal.
9. The organic light-emitting display device as claimed in claim 1 , further comprising a source driving unit and a data driving unit connected between the wirings and the pixels.
10. The organic light-emitting display device as claimed in claim 1 , wherein the circuit board is a flexible printed circuit (FPC) board.
11. The organic light-emitting display device as claimed in claim 1 , wherein the input pads are disposed at an edge of the substrate.
12. An input pad, comprising:
an extension portion;
a connection portion separated from the extension portion by a predetermined distance;
a resistance portion, directly disposed on a surface of a substrate of the input pad, contacting the extension portion and the connection portion; and
a dummy portion on the resistance portion and contacting the connection portion, the dummy portion being insulated from the extension portion, wherein the dummy portion has a larger electrical conductivity than that of the resistance portion, wherein the dummy portion is on top of the resistance portion.
13. The input pad as claimed in claim 12 , further comprising
an insulating layer on the dummy portion,
wherein the resistance portion contacts the extension portion through first contact holes in the insulating layer and contacts the connection portion through second contact holes in the insulating layer, and wherein the dummy portion contacts the connection portion through third contact holes in the insulating layer.
14. The input pad as claimed in claim 13 , wherein each of the first contact holes corresponds to a first edge portion of the resistance portion, each of the second contact holes corresponds to a second edge portion of the resistance portion, and the first and second edge portions of the resistance portion being opposite each other.
15. The input pad as claimed in claim 14 , wherein the first contact holes are adjacent to each other along a direction in which the first edge portion extends, and the second contact holes are adjacent to each other along a direction in which the second edge portion extends.
16. The input pad as claimed in claim 14 , wherein the third contact holes are disposed between the first contact holes and the second contact holes, the third contact holes being adjacent to the second contact holes.
17. The input pad as claimed in claim 16 , wherein the third contact holes are adjacent to each other along a direction in which either the first edge portion or the second edge portion extends.
18. The input pad as claimed in claim 12 , wherein
the resistance portion includes polysilicon, and
the dummy portion includes metal.
19. An input pad comprising:
a plurality of wiring connected to a unit, the input pad including,
an extension portion extending from a wiring, the extension portion being
greater than the wiring, a connection portion connected to a circuit board,
a resistance layer, disposed directly on a surface of a substrate, contacting the extension portion and the connection portion,
a dummy layer on the resistance layer, the dummy layer being insulated from the extension portion and contacting the connection portion, and
a first contact hole for the extension portion and second and third contact holes for the connection portion, wherein the first contact hole and the second contact hole directly expose the resistance layer and the third contact hole directly exposes the dummy layer, wherein the dummy layer is on top of the resistance layer.