EPOXY RESIN COMPOSITION, PREPREG, LAMINATE BOARD, AND MULTI-LAYER BOARD
The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition. The epoxy resin composition according to the present invention contains an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin. The bromine content in a resin component of the epoxy resin composition is 10 mass % or greater.
1 . An epoxy resin composition containing an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin,
the bromine content in a resin component of the epoxy resin composition being 10 mass % or greater.
2 . The epoxy resin composition according to claim 1 , wherein the silane compound is at least one species selected from an epoxy silane compound, an isocyanate silane compound and a mercapto silane compound.
3 . The epoxy resin composition according to claim 1 , containing 0.2 to 2.0 mass % of the silane compound with respect to a total amount of the epoxy resin composition.
4 . The epoxy resin composition according to claim 1 , containing an imidazole silane compound.
5 . The epoxy resin composition according to claim 4 , containing 0.2 to 0.4 mass % of imidazole silane compound with respect to a total amount of the epoxy resin composition.
6 . The epoxy resin composition according to claim 1 , wherein the epoxy resin contains an epoxy resin having an oxazolidone ring in the molecule.
7 . The epoxy resin composition according to claim 1 , containing an inorganic filler.
8 . A prepreg obtained by impregnating a substrate with the epoxy resin composition according to claim 1 and performing drying.
9 . A laminate board obtained by superposing and heat-pressing a required number of sheets of the prepreg according to claim 8 to form a laminate.
10 . A multi-layer board obtained by superposing the prepreg according to claim 8 on an inner layer circuit board and performing heat pressing thereon to form a laminate.
11 . The epoxy resin composition according to claim 2 containing an imidazole silane compound.
12 . The epoxy resin composition according to claim 2 wherein the epoxy resin contains an epoxy resin having an oxazolidone ring in the molecule.
13 . The epoxy resin composition according to claim 11 wherein the epoxy resin contains an epoxy resin having an oxazolidone ring in the molecule.
14 . A prepreg obtained by impregnating a substrate with the epoxy resin composition according to claim 2 and performing drying.
15 . A laminate board obtained by superposing and heat-pressing a required number of sheets of the prepreg according to claim 14 to form a laminate.
16 . A multi-layer board obtained by superposing the prepreg according to claim 14 on an inner layer circuit board and performing heat pressing thereon to form a laminate.
17 . A prepreg obtained by impregnating a substrate with the epoxy resin composition according to claim 4 and performing drying.
18 . A laminate board obtained by superposing and heat-pressing a required number of sheets of the prepreg according to claim 17 to form a laminate.
19 . A multi-layer board obtained by superposing the prepreg according to claim 17 on an inner layer circuit board and performing heat pressing thereon to form a laminate.
20 . A prepreg obtained by impregnating a substrate with the epoxy resin composition according to claim 11 and performing drying.
21 . A laminate board obtained by superposing and heat-pressing a required number of sheets of the prepreg according to claim 20 to form a laminate.
22 . A multi-layer board obtained by superposing the prepreg according to claim 20 on an inner layer circuit board and performing heat pressing thereon to form a laminate.