Light emitting device package, backlight unit, display device and lighting device

1. A light emitting device package comprising:

a package body providing a chip mounting area and including first and second lead terminals;

an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals;

a groove portion disposed around the LED chip in the chip mounting area; and

a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape substantially defined by the groove portion,

wherein the LED chip is mounted on an upper surface of one of the first and second lead terminals.

2. The light emitting device package of claim 1 , wherein the groove portion has a shape corresponding to an outer shape of the LED chip.

3. The light emitting device package of claim 2 , wherein the outer shape of the LED chip is polygonal, and the groove portion has a polygonal shape to enclose the LED chip.

4. The light emitting device package of claim 3 , wherein the outer shape of the LED chip is quadrangular, and the groove portion has a quadrangular shape to enclose the LED chip.

5. The light emitting device package of claim 1 , wherein the groove portion has a circular shape to enclose the LED chip.

6. The light emitting device package of claim 1 , wherein the wavelength conversion material is a phosphor, a quantum dot or a mixture thereof.

7. The light emitting device package of claim 6 , wherein the wavelength conversion material includes a mixture of at least green and red phosphors.

8. The light emitting device package of claim 7 , wherein the green phosphor is M 2 SiO 4 :R, β-SiAlON or a mixture thereof and the red phosphor is CaAlSiN 3 :R, M x Si y N( 2/3x+4/3y ) : R, MxSiyOzN(2/3x+4/3y-2/3z):R or a mixture thereof, where M is at least one selected from group II elements consisting of Mg, Ca, Sr, Ba and Zn and R is at least one selected from rare earth elements.

9. The light emitting device package of claim 6 , wherein the quantum dot of the wavelength conversion material includes a semiconductor nanocrystal including a group II-VI compound such as CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe and HgTe, a semiconductor nanocrystal including a group III-V compound such as GaN, GaP, GaAs, InP and InAs, or a mixture thereof.

10. The light emitting device package of claim 6 , wherein the wavelength conversion material includes a mixture of a plurality of phosphors having different light emitting colors and a red light emitting quantum dot.

11. An illumination device including the light emitting device package of claim 1 .

12. The light emitting device package of claim 1 , wherein the groove portion is formed in the upper surface of the lead terminal having the LED chip mounted thereon.

13. The light emitting device package of claim 1 , wherein the lead terminal having the LED chip mounted thereon has a heat sink extended downwards.

14. The light emitting device package of claim 1 , wherein the package body includes a ceramic substrate providing the chip mounting area, and

at least a portion of the groove portion is disposed in the ceramic substrate.

15. The light emitting device package of claim 1 , wherein the groove portion has a vertical cross section in a V-shaped, U-shaped, or quadrangular form.

16. The light emitting device package of claim 1 , wherein the groove portion Is formed by an imprinting or etching process.

17. The light emitting device package of claim 1 , wherein an area enclosed by the groove portion is set to be nine times or less an area of the LED chip.

18. The light emitting device package of claim 1 , wherein a length of a temporary straight line connecting a center of the LED chip to a point of the groove portion is set to be three times or less a length of the LED chip from the center of the LED chip to a point of an edge of the LED chip on which the straight line passes.

19. The light emitting device package of claim 1 , wherein a maximum height of the wavelength conversion portion is set to be four times or less a thickness of the LED chip.

20. The light emitting device package of claim 1 , further comprising, when the groove portion is defined as a first groove portion, a second groove portion disposed in the chip mounting area and uniformly spaced apart from the first groove portion while enclosing the first groove portion.

21. The light emitting device package of claim 20 , further comprising, when a wavelength conversion portion disposed along the first groove portion is defined as a first wavelength conversion portion, a second wavelength conversion portion disposed above the first wavelength conversion portion and defined by the second groove portion.

22. The light emitting device package of claim 21 , wherein the first and second wavelength conversion portions include different wavelength conversion materials emitting light of different wavelengths.

23. The light emitting device package of claim 22 , wherein the wavelength conversion material of the first wavelength conversion portion produces light having a wavelength shorter than that of light produced by the wavelength conversion material of the second wavelength conversion portion.

24. The light emitting device package of claim 1 , wherein the LED chip is connected to at least one of the first and second lead terminals by a wire, and a height of the wire is greater than a maximum height of a resin package portion.

25. The light emitting device package of claim 1 , wherein the package body includes a sidewall structure enclosing the chip mounting area.

26. An LED light source module including the light emitting device package of claim 1 .

27. A backlight unit including the light emitting device package of claim 1 .

28. A display device comprising:

a panel for displaying an image; and

the backlight unit of claim 27 , the backlight unit providing light to the panel.