IP Library Granted Patent US 8,890,649
Granted Patent B2
US 8,890,649 · App. 13/141,859 · Granted Nov 18, 2014

Bending sensor and deformed shape measurement method

Inventors: Yuuki Saitou (Komaki, JP); Masaru Murayama (Komaki, JP); Tomonori Hayakawa (Komaki, JP); Koichi Hasegawa (Komaki, JP); Tetsuyoshi Shibata (Komaki, JP)
Assignee: Tokai Rubber Industries, Ltd
G01L1/205G01M5/0041H01C17/06586G01B7/18H01C17/0652G01M5/0083H01C10/106
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Quick Facts
Patent No.
US 8,890,649
App. No.
13/141,859
Granted
Nov 18, 2014
Kind
B2
Abstract

Provided are a bending sensor that is less dependent on an input speed of a strain and in which a response delay is unlikely to occur, and a deformed shape measurement method using the bending sensor. The bending sensor is configured to include a base material; a sensor body arranged on a surface of the base material and containing a matrix resin and conductive filler particles filled in the matrix resin at a filling rate of 30% by volume or more, and in which three-dimensional conductive paths are formed by contact among the conductive filler particles, and electrical resistance increases as an deformation amount increases; an elastically deformable cover film arranged so as to cover the sensor body; and a plurality of electrodes connected to the sensor body and capable of outputting electrical resistances. In the sensor body, cracks are formed in advance in such a direction that the conductive paths are cut off during a bending deformation.

Claims (23)

1. A bending sensor comprising:

a base material;

a sensor body arranged on a surface of the base material and containing a matrix resin and conductive filler particles, the conductive filler particles being 30% by volume or more of the matrix resin, and in which three-dimensional conductive paths are defined by contact among the conductive filler particles and when a deformation amount of the sensor body increases, an electrical resistance increases;

an elastically deformable cover film arranged so as to cover the sensor body;

a strain adjustment plate arranged on a rear surface of the base material;

an adhesion layer bonding the strain adjustment plate and the base material; and

a plurality of electrodes connected to the sensor body and capable of outputting electrical resistances, wherein

cracks are provided in the sensor body along such a direction that the conductive paths are cut off during a bending deformation of the sensor body, the cracks being pre-formed on the sensor body by a deformation of a precursor of the sensor body along a mold surface of a mold for crack formation, and

the base material, the strain adjustment plate, and the adhesion layer are all made from materials having a glass-rubber transition region, in which a storage elastic modulus transitions, on one of a lower temperature side than a lower temperature limit of an operating temperature range of the bending sensor minus 10° C., or on a higher temperature side than an upper temperature limit of the operating temperature range of the bending sensor plus 10° C., and a pre-determined strain is provided in a bending direction in the sensor body.

2. The bending sensor according to claim 1 , wherein the conductive filler particles have an average particle size of 0.05 μm or more and 100 μm or less.

3. The bending sensor according to claim 1 , wherein the conductive filler particles are spherical carbon particles.

4. The bending sensor according to claim 1 , wherein, when a plurality of unit sections each having a length of 2 mm or less are partitioned in the sensor body in a direction along which the electrodes are arranged, at least one crack is provided in each of the unit sections.

5. The bending sensor according to claim 1 , wherein the plurality of the electrodes are a printed conductive paint on the base material.

6. The bending sensor according to claim 5 , wherein the electrodes have such a surface shape that an edge line in a direction along which the sensor body extends has a curved portion.

7. The bending sensor according to claim 1 further comprising wirings respectively connected to the electrodes, the wirings being an etched metal foil.

8. The bending sensor according to claim 1 , wherein, between two of the electrodes, the sensor body has a plurality of detection sections lined up in a perpendicular direction, each of the detection sections extending in a juxtaposing direction, the juxtaposing direction being a direction along which the two electrodes line up, and the perpendicular direction being a direction perpendicular to the juxtaposing direction.

9. The bending sensor according to claim 8 , wherein, between neighboring two of the electrodes, the detection sections are mutually electrically connected in parallel.

10. The bending sensor according to claim 8 , wherein, between neighboring two of the electrodes, the detection sections are mutually electrically connected in series.

11. The bending sensor according to claim 8 , wherein at least five of the detection sections are arranged.

12. A deformed shape measurement method comprising:

a detection process detecting a bending deformation of the bending sensor according to claim 1 for each of a plurality of measurement sections partitioned by the electrodes;

a partial shape calculation process calculating deformed shapes of the measurement sections based on detected deformation data of the measurement sections; and

an entire shape calculation process calculating an entire deformed shape of the bending sensor by joining together the calculated deformed shapes of the measurement sections.

Assignments (2)
CHANGE OF NAME Recorded Oct 20, 2014
From: TOKAI RUBBER INDUSTRIES, LTD.
To: SUMITOMO RIKO COMPANY LIMITED
Reel/Frame 034016/0556 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 1, 2011
From: SAITOU, YUUKI; MURAYAMA, MASARU; HAYAKAWA, TOMONORI; HASEGAWA, KOICHI; SHIBATA, TETSUYOSHI
To: TOKAI RUBBER INDUSTRIES, LTD
Reel/Frame 026842/0310 →
Priority Claims (3)
JP 2009-266097 · Nov 24, 2009 · national
JP 2010-152907 · Jul 5, 2010 · national
JP 2010-168868 · Jul 28, 2010 · national
Continuity (1)
Related Publication 20110307214A1 · Dec 15, 2011