PREGREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm −1 due to nitrile groups (P CN ) with respect to the peak height near 1730 cm −1 due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
1 . A prepreg formed by impregnating a fiber base material with a resin composition, wherein:
the resin composition comprises an acrylic resin, and
the ratio of the peak height near 2240 cm −1 due to nitrile groups (P CN ) to the peak height near 1730 cm −1 due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001.
2 . A prepreg according to claim 1 , wherein the acrylic resin is an acrylic resin obtained by polymerizing a monomer mixture containing 5-30 parts by weight of a compound represented by the following formula (1), 0.5-30 parts by weight of a functional group-containing monomer, and 40-94.5 parts by weight of another monomer that is copolymerizable with these components and has no nitrile groups in the structure, combined to a total amount of 100 parts by weight:
wherein R 1 represents a hydrogen atom or a methyl group and R 2 represents a C5-10 cycloalkyl, C6-13 cycloalkylalkyl, C6-10 aryl or C7-13 aralkyl group.
3 . A prepreg according to claim 2 , wherein the acrylic resin is one employing a methacrylic acid ester or acrylic acid ester having a C5-10 cycloalkyl group in the ester portion, as the compound represented by formula (1).
4 . A prepreg according to claim 2 , wherein the C5-10 cycloalkyl group contains at least one group selected from the group consisting of cyclohexyl, norbornyl, tricyclodecanyl, isobornyl and adamantyl.
5 . A prepreg formed by impregnating a fiber base material with a resin composition, wherein:
the resin composition comprises an acrylic resin,
the acrylic resin being an acrylic resin obtained by polymerizing a monomer mixture containing 5-30 parts by weight of a compound represented by the following formula (1), 0.5-30 parts by weight of a functional group-containing monomer, and 40-94.5 parts by weight of another monomer that is copolymerizable with these components and has no nitrile groups in the structure, combined to a total amount of 100 parts by weight:
wherein R 1 represents a hydrogen atom or a methyl group and R 2 represents a C5-10 cycloalkyl, C6-13 cycloalkylalkyl, C6-10 aryl or C7-13 aralkyl group.
6 . A prepreg according to claim 5 , wherein the acrylic resin is one employing a methacrylic acid ester or acrylic acid ester having a C5-10 cycloalkyl group in the ester portion, as the compound represented by formula (1).
7 . A prepreg according to claim 6 , wherein the C5-10 cycloalkyl group contains at least one group selected from the group consisting of cyclohexyl, norbornyl, tricyclodecanyl, isobornyl and adamantyl.
8 . A prepreg according to claim 5 , wherein the another monomer is selected from among acrylic acid esters, methacrylic acid esters, aromatic vinyl compounds and N-substituted maleimides.
9 . A prepreg according to claim 1 , wherein the weight-average molecular weight (Mw) of the acrylic resin is 50,000-1,500,000.
10 . A prepreg according to claim 2 , wherein the functional group-containing monomer is a monomer with at least one functional group selected from the group consisting of carboxyl, hydroxyl, acid anhydride, amino, amide and epoxy groups.
11 . A film with a resin, comprising a B-stage resin film formed using a resin composition, provided on a support film, wherein:
the resin composition comprises an acrylic resin, and
the ratio of the peak height near 2240 cm −1 due to nitrile groups (P CN ) to the peak height near 1730 cm −1 due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001.
12 . A film with a resin, comprising a B-stage resin film formed using a resin composition, provided on a support film, wherein:
the resin composition comprises an acrylic resin,
the acrylic resin being an acrylic resin obtained by polymerizing a monomer mixture containing 5-30 parts by weight of a compound represented by the following formula (1), 0.5-30 parts by weight of a functional group-containing monomer, and 40-94.5 parts by weight of another monomer that is copolymerizable with these components and has no nitrile groups in the structure, combined to a total amount of 100 parts by weight:
wherein R 1 represents a hydrogen atom or a methyl group and R 2 represents a C5-10 cycloalkyl, C6-13 cycloalkylalkyl, C6-10 aryl or C7-13 aralkyl group.
13 . A metal foil with a resin, comprising a resin layer formed using a resin composition, and a metal foil provided on at least one side of the resin layer, wherein:
the resin composition comprises an acrylic resin, and
the ratio of the peak height near 2240 cm −1 due to nitrile groups (P CN ) to the peak height near 1730 cm −1 due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001.
14 . A metal foil with a resin, comprising a resin layer formed using a resin composition, and a metal foil provided on at least one side of the resin layer, wherein:
the resin composition comprises an acrylic resin,
the acrylic resin being an acrylic resin obtained by polymerizing a monomer mixture containing 5-30 parts by weight of a compound represented by the following formula (1), 0.5-30 parts by weight of a functional group-containing monomer, and 40-94.5 parts by weight of other monomer(s) that is copolymerizable with these components and has no nitrile groups in the structure, combined to a total amount of 100 parts by weight:
wherein R 1 represents a hydrogen atom or a methyl group and R 2 represents a C5-10 cycloalkyl, C6-13 cycloalkylalkyl, C6-10 aryl or C7-13 aralkyl group.
15 . A metal-clad laminate, comprising a substrate having a fiber base material embedded in a cured resin and a metal foil formed on at least one side of the substrate, wherein:
the cured resin is formed by curing a resin composition comprising an acrylic resin, and
the ratio of the peak height near 2240 cm −1 due to nitrile groups (P CN ) to the peak height near 1730 cm −1 due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001.
16 . A metal-clad laminate, comprising a substrate having a fiber base material embedded in a cured resin and a metal foil formed on at least one side of the substrate, wherein:
the cured resin is formed by curing a resin composition comprising an acrylic resin,
the acrylic resin being an acrylic resin obtained by polymerizing a monomer mixture containing 5-30 parts by weight of a compound represented by the following formula (1), 0.5-30 parts by weight of a functional group-containing monomer, and 40-94.5 parts by weight of another monomer that is copolymerizable with these components and has no nitrile groups in the structure, combined to a total amount of 100 parts by weight:
wherein R 1 represents a hydrogen atom or a methyl group and R 2 represents a C5-10 cycloalkyl, C6-13 cycloalkylalkyl, C6-10 aryl or C7-13 aralkyl group.
17 . A printed wiring board comprising at least a prepreg according to claim 1 .
18 . A prepreg according to claim 5 , wherein the weight-average molecular weight (Mw) of the acrylic resin is 50,000-1,500,000.
19 . A prepreg according to claim 5 , wherein the functional group-containing monomer is a monomer with at least one functional group selected from the group consisting of carboxyl, hydroxyl, acid anhydride, amino, amide and epoxy groups.
20 . A printed wiring board comprising at least a prepreg according to claim 5 .
21 . A printed wiring board comprising at least a film with a resin according to claim 11 .
22 . A printed wiring board comprising at least a film with a resin according to claim 12 .
23 . A printed wiring board comprising at least a metal foil with a resin according to claim 13 .
24 . A printed wiring board comprising at least a metal foil with a resin according to claim 14 .
25 . A printed wiring board comprising at least a metal-clad laminate according to claim 15 .
26 . A printed wiring board comprising at least a metal-clad laminate according to claim 16 .