IP Library Granted Patent US 9,688,801
Granted Patent B2
US 9,688,801 · App. 13/148,138 · Granted Jun 27, 2017

Vinyl polymer powder, curable resin composition and cured substance

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Quick Facts
Patent No.
US 9,688,801
App. No.
13/148,138
Granted
Jun 27, 2017
Kind
B2
Abstract

Disclosed is a vinyl polymer powder which is superior to dispersibility to curable resin compositions, which immediately gives a gel state for curable resin compositions by short-time heating with predetermined temperature, which is with high ion concentration, and which is useful as a pre-gel agent suitable for fields of electronic materials, to provide a curable resin composition comprising the vinyl polymer powder, and to provide a cured substance of the curable resin composition. The vinyl polymer powder of the present invention has an acetone-soluble component of 30% by mass or more, mass average molecular weight of the acetone-soluble component of 100,000 or more, a content of an alkali metal ion of 10 ppm or less, and a volume average primary particle size (Dv) of 200 nm or more.

Claims (14)

1. A curable resin composition, comprising:

1 to 30% by mass of a vinyl polymer powder; and

70 to 99% by mass of a curable resin;

wherein the vinyl polymer powder comprises a primary particle having a core shell morphology wherein at least one of a solubility parameter and molecular weight is different for the core and the shell of the primary particle,

an acetone-soluble component of the vinyl polymer powder is 30% by mass or more,

a mass average molecular weight of the acetone-soluble component is 100,000 or more,

a content of an alkali metal ion of the vinyl polymer powder is 10 ppm or less,

a volume average particle size (Dv) of the primary particle is from 500 nm to 830 nm, and

the curable resin is an epoxy resin which is liquid at 25° C.

2. A cured substance obtained by curing of the curable resin composition according to claim 1 .

3. A sealing material for a semiconductor, comprising in a cured form, the curable resin composition according to claim 1 .

4. A sheet product, comprising in a cured form, the curable resin composition according to claim 1 .

5. The vinyl polymer powder according to claim 1 , wherein a sulfate ion (SO 4 2− ) content is 20 ppm or less.

6. The vinyl polymer powder according to claim 1 , wherein a ratio (D v /D n ) of the volume average primary particle size (D v ) to a number average primary particle size (D n ) is 3.0 or less.

Assignments (2)
CHANGE OF NAME Recorded Jun 28, 2017
From: MITSUBISHI RAYON CO., LTD.
To: MITSUBISHI CHEMICAL CORPORATION
Reel/Frame 043028/0747 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2011
From: FUKUTANI, KAORI; KASAI, TOSHIHIRO
To: MITSUBISHI RAYON CO., LTD.
Reel/Frame 026719/0686 →