IP Library Granted Patent US 8,901,945
Granted Patent B2
US 8,901,945 · App. 13/149,315 · Granted Dec 2, 2014

Test board for use with devices having wirelessly enabled functional blocks and method of using same

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Quick Facts
Patent No.
US 8,901,945
App. No.
13/149,315
Granted
Dec 2, 2014
Kind
B2
Abstract

A test board is provided. The test board includes a test module configured to accommodate an integrated circuit (IC) device and first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device.

Claims (37)

1. A test board, comprising:

a test module configured to accommodate an integrated circuit (IC) device, the IC device including an IC die;

first wirelessly enabled functional blocks located in the test module and configured to communicate with second wirelessly enabled functional blocks of the IC device, the second wirelessly enabled functional blocks being electrically coupled to the IC die; and

a controller configured to control the first wirelessly enabled functional blocks to transmit respective signals to respective ones of the second wirelessly enabled functional blocks to test an operation of the IC device.

2. The test board of claim 1 , farther comprising:

a circuit board; and

a pin that couples the test module to the circuit board, wherein the pin is electrically coupled to a wirelessly enabled functional block of the first wirelessly enabled functional blocks.

3. The test board of claim 2 , wherein the circuit board comprises:

a wireless bus coupled to the pin.

4. The test board of claim 1 , further comprising:

a second test module configured to accommodate a second IC device; and

a wireless bus coupled to at least one pin of the test module and at least one pin of the second test module.

5. The test board of claim 1 , further comprising:

connection elements located in the test module and configured to be coupled to connection elements of the IC device.

6. The test board of claim 5 , wherein the connection elements of the test module comprise a pin.

7. The test board of claim 6 , wherein the connection elements of the IC device comprise a solder ball.

8. The test board of claim 6 , wherein the pin is configured to provide a power signal or a ground signal.

9. The test board of claim 1 , wherein each of the first wirelessly enabled functional blocks comprises an antenna.

10. The test board of claim 9 , wherein each of the first wirelessly enabled functional blocks farther comprises a transceiver.

11. The test board of claim 9 , wherein at least one of the antennas is a dipole antenna.

12. The test board of claim 1 , Wherein the test module comprises a socket.

13. The test board of claim 1 , wherein the test module comprises a platform.

14. The test board of claim 13 , wherein the test module further comprises a post.

15. A method of testing an integrated circuit (IC) device coupled to a test module of a test board, wherein the test module comprises first wirelessly enabled functional blocks and wherein the IC device comprises second wirelessly enabled functional blocks, comprising:

generating a signal using a controller;

transmitting the signal from at least one of the first wirelessly enabled functional blocks to at least one of the second wirelessly enabled functional blocks;

receiving a response to the signal generated by the IC device at the test board through a first wirelessly enabled functional block; and

evaluating the response using the controller to determine whether the IC device is operating properly.

16. The method of claim 15 , further comprising:

transmitting the signal to the test module using a wireless bus.

17. The method of claim 15 , further comprising:

transmitting the response to the controller using a wireless bus.

18. The method of claim 15 , wherein the testing module comprises a connection element, further comprising:

transmitting a second signal to the IC device using the connection element.

19. The method of claim 18 , wherein the second signal is a power signal or a ground signal.

20. The method of claim 15 , wherein transmitting comprises:

generating a wireless signal corresponding to the signal using the at least one of the first wirelessly enabled functional blocks.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE MERGER PREVIOUSLY RECORDED ON REEL 047642 FRAME 0417. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT, Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048521/0395 →
MERGER Recorded Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047642/0417 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2011
From: ZHAO, SAM ZIQUN; ROFOUGARAN, AHMADREZA; BEHZAD, ARYA; CASTANEDA, JESUS; BOERS, MICHAEL
To: BROADCOM CORPORATION
Reel/Frame 026363/0860 →