Method and system for internal layer-layer thermal enhancement
View Patent ↗The exemplary embodiments of the present invention provide a method and apparatus for enhancing the cooling of a chip stack of semiconductor chips. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes creating a cavity in a second side of the first chip between the connectors and filling the cavity with a thermal material. The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed.
1. A method for enhancing the cooling of a chip stack of semiconductor chips, comprising:
creating a first chip with circuitry on a first side;
creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors;
creating a cavity in a second side of the first chip between the connectors; and
filling the cavity with a thermal material.
2. The method of claim 1 , wherein the cavity is created by removing material from the first chip.
3. The method of claim 2 , wherein the cavity is created using an etching process.
4. The method of claim 2 , wherein the cavity is created using a milling process.
5. The method of claim 1 , wherein the thermal material is a thermal grease that includes a conductive particulate.
6. The method of claim 1 , wherein the thermal material comprises:
a first thermal filler material used to fill a lower portion of the cavity; and
a second thermal filler material used to fill an upper portion of the cavity.
7. The method of claim 6 , wherein the first thermal filler material in the cavity is electrically isolated from the grid of connectors.
8. A system for enhancing the cooling of a chip stack of semiconductor chips, comprising:
a means for creating a first chip with circuitry on a first side;
a means for creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors;
a means for creating a cavity in a second side of the first chip between the connectors; and
a means for filling the cavity with a thermal material.
9. The system of claim 8 , wherein the means for creating cavity is created by a means for removing material from the first chip.
10. The system of claim 8 , wherein the means for creating cavity is an etching process.
11. The system of claim 8 , wherein the means for creating cavity is a milling process.
12. The system of claim 8 , wherein the thermal material is a thermal grease that includes a conductive particulate.
13. The system of claim 8 , wherein the thermal material comprises:
a first thermal filler material used to fill a lower portion of the cavity; and
a second thermal filler material used to fill an upper portion of the cavity.
14. The system of claim 13 , wherein the first thermal filler material in the cavity is electrically isolated from the grid of connectors.
15. A chip stack of semiconductor chips with enhanced cooling comprising:
a first chip with circuitry on a first side;
a second chip electrically and mechanically coupled to the first chip by a grid of connectors; and
wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed.
16. The apparatus of claim 15 , wherein the cavity is created using an etching process.
17. The apparatus of claim 15 , wherein the cavity is created using a milling process.
18. The apparatus of claim 15 , wherein the thermal material is a thermal grease that includes a conductive particulate.
19. The apparatus of claim 15 , wherein the thermal material comprises:
a first thermal filler material used to fill the lower portion of the cavity; and
a second thermal filler material used to fill the upper portion of the cavity.
20. The apparatus of claim 19 , wherein the first thermal filler material in the cavity is electrically isolated from the grid of connectors.