IP Library Granted Patent US 8,704,714
Granted Patent B2
US 8,704,714 · App. 13/151,739 · Granted Apr 22, 2014

Surface mount module embedded antenna

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Quick Facts
Patent No.
US 8,704,714
App. No.
13/151,739
Granted
Apr 22, 2014
Kind
B2
Abstract

An apparatus includes a dielectric sheet, and an antenna structure. The antenna structure comprises a first conductive portion located on an exterior surface of the dielectric sheet and a second conductive portion buried in the dielectric sheet and configured for coupling to a return portion of the wireless communication circuit. The second conductive portion includes a plane area adjacent to the first conductive portion in a region proximal to the feed portion and separated from the first conductive portion by a portion of the dielectric sheet, a curved transition portion, the transition portion including a lateral width that tapers along the length of the second conductive portion, and a distal portion comprising two parallel conductive strips, the distal portion electrically coupled to the plane area via the curved transition portion, wherein the parallel conductive strips are thinner in lateral width than the plane area.

Claims (43)

1. An apparatus, comprising:

a dielectric sheet;

an antenna structure including:

a first conductive portion located on an exterior surface of the dielectric sheet and configured for coupling to an antenna feed for a wireless communication circuit; and

a second conductive portion buried in the dielectric sheet and configured for coupling to a return portion of the wireless communication circuit, the second conductive portion including:

a plane area adjacent to the first conductive portion in a region proximal to the feed portion and separated from the first conductive portion by a portion of the dielectric sheet;

a curved transition portion, the transition portion including a lateral width that tapers along the length of the second conductive portion; and

a distal portion comprising two parallel conductive strips, the distal portion electrically coupled to the plane area via the curved transition portion, wherein the parallel conductive strips are thinner in lateral width than the plane area.

2. The apparatus of claim 1 , further comprising the wireless communication circuit, wherein the wireless communication circuit includes an antenna feed coupled to the first conductive portion and a return portion coupled to the plane area of the buried second conductive portion.

3. The apparatus of claim 1 , wherein the dielectric sheet is selected from one or more of a flexible printed circuit board substrate material or a rigid printed circuit board substrate material.

4. The apparatus of claim 3 , wherein the apparatus is configured for surface mount attachment to a second printed circuit board assembly.

5. The apparatus of claim 3 , wherein the first conductive portion is covered with another dielectric sheet comprising a solder mask material or a conformal coating.

6. The apparatus of claim 3 , wherein the dielectric sheet further includes a metal layer configured to provide electrical interconnections for circuitry, and wherein one or more of the first or second conductive portions comprises a portion of the metal layer.

7. The apparatus of claim 3 , wherein the dielectric sheet comprises two or more layers of dielectric material; and

wherein the buried second conductive portion is located on a metal layer between two of the dielectric layers of the dielectric sheet.

8. The apparatus of claim 7 , wherein one of the two dielectric layers includes an electrical interconnect configured for attachment to a second printed circuit board assembly.

9. The apparatus of claim 8 , wherein the antenna structure is configured for operation within a specified range of frequencies spanning at least 500 MHz when the printed circuit board assembly is attached to the second printed circuit board assembly.

10. The apparatus of claim 9 , wherein the transition portion is configured to provide a specified input impedance range within the specified range of frequencies.

11. A printed circuit board assembly, comprising:

a dielectric sheet having two or more layers of dielectric material;

an antenna structure including:

a first conductive portion located on an exterior surface of the dielectric sheet and configured for coupling to an antenna feed for a wireless communication circuit; and

a second conductive portion located on a metal layer between two of the dielectric layers of the dielectric sheet and configured for coupling to a return portion of the wireless communication circuit, the second conductive portion including:

a plane area adjacent to the second conductive portion in a region proximal to the feed portion and separated from the first conductive portion by a portion of the dielectric sheet;

a curved transition portion, the transition portion including a lateral width that tapers along the length of the second conductive portion; and

a distal portion comprising two parallel conductive strips, the distal portion electrically coupled to the plane area via the curved transition portion, wherein the parallel conductive strips are thinner in lateral width than the plane area; and

a wireless communication circuit, wherein the wireless communication circuit includes an antenna feed coupled to the first conductive portion and a return portion coupled to the plane area of the second conductive portion.

12. A method, comprising:

forming an antenna structure including:

forming a first conductive portion located on an exterior surface of the dielectric sheet and configured for coupling to an antenna feed for a wireless communication circuit; and

forming a second conductive portion buried in a dielectric sheet and configured for coupling to a return portion of the wireless communication circuit, the second conductive portion including:

a plane area adjacent to the first conductive portion in a region proximal to the feed portion and separated from the first conductive portion by a portion of the dielectric sheet;

a curved transition portion, the transition portion including a lateral width that tapers along the length of the buried second conductive portion; and

a distal portion comprising two parallel conductive strips, the distal portion electrically coupled to the plane area via the curved transition portion, wherein the parallel conductive strips are thinner in lateral width than the plane area.

13. The method of claim 12 , wherein the dielectric sheet is selected from one or more of a flexible printed circuit board substrate material or a rigid printed circuit board substrate material.

14. The method of claim 13 , comprising attaching the antenna structure to a second printed circuit board assembly via a surface mount attachment technique.

15. The method of claim 13 , comprising covering the first conductive portion with another dielectric sheet comprising a solder mask material or a conformal coating.

16. The method of claim 13 , comprising forming the dielectric sheet including a metal layer configured to provide electrical interconnections for circuitry, and wherein one or more of the first or second conductive portions comprises a portion of the metal layer.

17. The method of claim 16 , wherein the dielectric sheet comprises two or more layers of dielectric material; and

wherein the buried second conductive portion is located on a metal layer between the two dielectric layers.

18. The method of claim 17 , comprising forming, on one of the two dielectric layers, an electrical interconnect configured for attachment to a second printed circuit board assembly.

19. The method of claim 18 , comprising wirelessly transferring information electromagnetically using the antenna structure within a specified range of frequencies.

20. The method of claim 19 , wherein the specified range of frequencies spans at least 500 MHz when the printed circuit board assembly is attached to the second printed circuit board assembly.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Dec 8, 2023
From: BMO BANK N.A., AS ADMINISTRATIVE AGENT
To: DIGI INTERNATIONAL INC.
Reel/Frame 065835/0205 →
SECURITY INTEREST Recorded Dec 8, 2023
From: DIGI INTERNATIONAL INC.
To: BMO BANK N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 065836/0981 →
SECURITY INTEREST Recorded Dec 19, 2019
From: DIGI INTERNATIONAL INC.
To: BMO HARRIS BANK N.A.
Reel/Frame 051370/0023 →