Memory cell with Schottky diode

1. An addressable memory cell comprising:

a first conductor;

a second conductor; and

a serially connected magnetic storage element and a Schottky diode, between said two conductors,

wherein said Schottky diode replaces an address transistor of a conventional memory cell to enable reading of said storage element without activating an address transistor associated with said cell and provides a unidirectional conductive path between said two conductors and through said element, said diode being disposed according to one of the following two configurations:

(i) between said first conductor and said element in a first configuration, wherein said diode comprises a junction between a first metal layer and a first junction layer, wherein said first conductor comprises said first metal layer, and

(ii) between said second conductor and said element in a second configuration, wherein said diode comprises a junction between a second metal layer and a second junction layer, wherein said second conductor comprises said second metal layer.

2. The memory cell of claim 1 , wherein said first and second junction layers comprise titanium nitride (TiN).

3. The memory cell of claim 2 wherein said TiN in said first and second junction layers follow at least one of the following process conditions:

a) deposition at about 100 degrees centigrade, and

b) deposition at about 200 Angstrom in thickness.

4. A method of fabricating said memory cell of claim 2 , said method comprising at least either of the following:

a) depositing said TiN in said first and second junction layers at about 100 degrees centigrade, and

b) depositing said TiN in said first and second junction layers at about 200 Angstrom in thickness.

5. The memory cell of claim 1 , wherein said element is a magnetic tunnel junction (MTJ) stack.

6. The memory cell of claim 1 , wherein said first conductor is a word line and said second conductor is a bit line.

7. The memory cell of claim 1 , wherein said first metal layer and said second metal layer comprise aluminum.

8. The memory cell of claim 1 wherein said first conductor, said element, said diode and said second conductor are all vertically stacked on a substrate.

9. The memory cell of claim 8 wherein said second junction layer is atop said element in said second configuration.

10. The memory cell of claim 9 wherein said second junction layer is used as a hard mask for defining said element.

11. A method of fabricating said memory cell of claim 9 , said method comprising:

using said second junction layer as a hard mask for defining said element.

12. A magnetic random access memory (MRAM) circuit comprising an array of memory cells of claim 1 .

13. A magnetic random access memory (MRAM) circuit comprising an array of addressable memory cells, wherein each said memory cell comprises:

a word line;

a bit line; and

a serially connected magnetic tunnel junction (MTJ) stack and a Schottky diode, between said two lines,

wherein said Schottky diode replaces an address transistor of a convention memory cell to enable reading said MTJ stack of a selected cell without activating an address transistor associated with said selected cell and provides a unidirectional conductive path between said two lines and through said element, said diode being disposed according to one of the following two configurations:

(i) between said word line and said MTJ stack in a first configuration, wherein said diode comprises a junction between a first metal layer and a first junction layer, wherein said word line comprises said first metal layer, and

(ii) between said bit line and said MTJ stack in a second configuration, wherein said diode comprises a junction between a second metal layer and a second junction layer, wherein said bit line comprises said second metal layer.

14. The MRAM circuit of claim 13 , wherein said first and second junction layers comprise titanium nitride (TiN).

15. The MRAM circuit of claim 14 , wherein said TiN in said first and second junction layers follow at least one of the following process conditions:

a) deposition at about 100 degrees centigrade, and

b) deposition at about 200 Angstrom in thickness.

16. The MRAM circuit of claim 13 , wherein said first metal layer and said second metal layer comprise aluminum.

17. The MRAM circuit of claim 13 wherein said word line, said MTJ stack, said diode and said bit line are all vertically stacked on a substrate.

18. The MRAM circuit of claim 17 wherein said second junction layer is atop said MTJ stack in said second configuration.

19. The MRAM circuit of claim 18 wherein said second junction layer is used as a hard mask for defining said element.

20. A method of addressing a memory cell in a magnetic random access memory (MRAM) circuit, wherein said cell comprises a word line, a bit line and a magnetic tunnel junction (MTJ) stack between said two lines, said method comprising:

applying a voltage to said bit line of said cell;

providing a unidirectional conductive path between said two lines and through said MTJ stack by using a Schottky diode that is serially connected to said MTJ stack, said diode being disposed according to one of the following two configurations:

(i) between said word line and said MTJ stack in a first configuration, wherein said diode comprises a junction between a first metal layer and a first junction layer, wherein said word line comprises said first metal layer, and

(ii) between said bit line and said MTJ stack in a second configuration, wherein said diode comprises a junction between a second metal layer and a second junction layer, wherein said bit line comprises said second metal layer; and

sensing a magnitude of a current flowing through said diode to said word line without activating an address transistor associated with said cell.