IP Library Granted Patent US 8,558,263
Granted Patent B2
US 8,558,263 · App. 13/159,993 · Granted Oct 15, 2013

Nitride semiconductor light-emitting device having high light efficiency and method of manufacturing the same

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Quick Facts
Patent No.
US 8,558,263
App. No.
13/159,993
Granted
Oct 15, 2013
Kind
B2
Abstract

Provided is a nitride semiconductor light emitting diode and a method of manufacturing the same. The method includes sequentially forming a first semiconductor layer, an active layer, and a second semiconductor layer on a substrate, in-situ depositing a mask layer on a region of the surface of the second semiconductor layer, and selectively growing a third semiconductor layer formed in a textured structure on the second semiconductor layer by depositing a semiconductor material on the second semiconductor layer and the mask layer.

Claims (13)

1. A semiconductor light emitting diode comprising:

a first semiconductor layer;

an active layer formed on the first semiconductor layer;

a second semiconductor layer formed on the active layer:

a mask layer formed on the second semiconductor layer, the mask layer having a plurality of openings, and having a thickness thinner than that of the second semiconductor layer;

a third semiconductor layer, having a textured structure on an upper surface thereof, formed on a surface of the second semiconductor layer through the plurality of openings; and

a transparent electrode formed on the third semiconductor layer, having a textured structure on an upper surface thereof, and having a shape which corresponds to that of the textured structure of the third semiconductor layer,

wherein the first semiconductor layer is an n-type semiconductor layer and the second and third semiconductor layers are p-type semiconductor layers.

2. The semiconductor light emitting diode of claim 1 , wherein the mask layer is formed of a material that comprises Si x N y .

3. The semiconductor light emitting diode of claim 1 , wherein openings among the plurality of openings have irregular sizes and periods.

4. The semiconductor light emitting diode of claim 1 , wherein the third semiconductor layer is made of the same material as that of the second semiconductor layer.

5. The semiconductor light emitting diode of claim 1 , wherein light generated by the active layer is extracted to the outside through the transparent electrode.

6. The semiconductor light emitting diode of claim 1 , wherein at least a portion of an upper surface of the mask layer is covered with the third semiconductor layer.

Assignments (1)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →