Method of manufacturing conductive structures
View Patent ↗The present invention relates to a method of manufacturing a web of a plurality of conductive structures which may be used for example to produce an antenna, electronic circuit, photovoltaic module or the like. The method involved simultaneously patterning at least one pattern in a conductive layer using a plurality of registration marks. The registration marks serve to align and guide the creation of the plurality of conductive structures. Optical brighteners may also be utilized within the adhesive layer and the registration marks of the present invention in order to detect the location where conductive structures are to be placed.
1. A web of conductive structures comprising:
a substrate having first and second faces;
a layer of adhesive provided over the first face of the substrate;
a plurality of patterned registration marks provided on top of the adhesive layer, the plurality of registration marks each provided with an optical brightener;
a conductive layer provided over the adhesive layer and spaced apart from the plurality of patterned registration marks such that the conductive layer does not cover the plurality of patterned registration marks;
at least one conductive structure formed by laser cutting of the conductive layer; and
wherein the at least one conductive structure is aligned by reference to at least one of the plurality of registration marks.
2. The web of claim 1 , including a pattern of variable or personalized patterns formed by laser cutting a pattern in the conductive layer.
3. The web of claim 2 , including a second pattern of variable or personalized information that is separate from the conductive structures.
4. The web of claim 1 , wherein the conductive structures are antennas.
5. The web of claim 1 , wherein the adhesive layer is provided in a pattern which corresponds to a shape of a conductive structure.
6. The web of claim 1 , wherein the conductive layer is made out of one of a group selected from aluminum, copper, silver, gold or alloys of metals.
7. The web of claim 1 , wherein the adhesive layer is transparent.
8. The web of claim 1 , wherein the registration marks are provided in a machine direction.
9. The web of claim 1 , wherein the adhesive layer is flood coated on the substrate.
10. The web of claim 9 , wherein areas of the adhesive layer are deadened where conductive structures are not formed.
11. The web of claim 10 , wherein the areas are deadened by a UV source.
12. A substrate having a conductive structure, comprising;
a substrate having first and second parts and first and second faces;
a plurality of patterned registration marks provided on the first face of the substrate, the plurality of registration marks each provided with an optical brightener;
a layer of transparent adhesive on top of at least a portion of the first part of the first face;
a conductive layer over the top of the layer of transparent adhesive;
a conductive pattern provided in the first part, the conductive pattern formed by laser die cutting of the conductive layer; and
indicia provided on the second part of the first face, the indicia formed by laser die cutting;
wherein the conductive pattern and the indicia are aligned by reference to the plurality of patterned registration marks.
13. The substrate of claim 12 , wherein the optical brightener is a fluorescent powder.
14. The substrate of claim 13 , wherein the fluorescent powder is 1% of the total weight of the adhesive layer.
15. The substrate of claim 13 , wherein the optical brightener includes UV detectable elements.
16. A web of conductive structures comprising:
a substrate having first and second faces;
a layer of adhesive having active areas and deadened areas, the adhesive layer provided on the substrate first face;
at least one registration mark is within the adhesive layer wherein the at least one registration mark is provided with at least one optical brightener;
a conductive layer provided over the active areas of the layer of adhesive;
at least one conductive structure formed by laser cutting of the conductive layer; and
wherein the at least one conductive structure is aligned with the at least one registration mark.