Semiconductor device, method for manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and method for evaluating semiconductor device
The present teachings provide a method for manufacturing a semiconductor device including a semiconductor substrate and a lower surface electrode in which an aluminum containing layer, a titanium layer, a nickel layer, and a nickel oxidation-prevention layer are laminated in order from a semiconductor substrate side, wherein the titanium layer of the lower electrode is formed by sputtering in an atmosphere of a partial pressure of oxygen being equal to or less than 5×10 −6 Pa.
1. An apparatus for manufacturing a semiconductor device including a semiconductor substrate and a lower surface electrode in which an aluminum containing layer, a titanium layer, a nickel layer, and a nickel oxidation-prevention layer are laminated in order from a semiconductor substrate side, the apparatus comprising:
a sputtering apparatus;
a detector that detects a partial pressure of oxygen in a chamber of the sputtering apparatus;
a decompressor that adjusts the partial pressure of oxygen in the chamber; and
a controller that is electrically connected to the decompressor and the detector, and controls the decompressor according to a detected value of the detector and decreases the partial pressure of oxygen in the chamber to be within equal to or more than 3×10 −6 Pa and equal to or less than 5×10 −6 Pa when the sputtering apparatus forms the titanium layer by sputtering.
2. The apparatus according to claim 1 , wherein the controller controls the sputtering apparatus to start sputtering to form the titanium layer in a case where the detected value is equal to or less than a threshold pressure that is predeterminedly set within a range equal to or more than 3×10 −6 Pa and equal to or less than 5×10 −6 Pa.
3. A method for evaluating quality of a semiconductor device including a semiconductor substrate and a lower surface electrode in which an aluminum containing layer, a titanium layer, a nickel layer, and a nickel oxidation-prevention layer are laminated in order from a semiconductor substrate side,
wherein the semiconductor device is judged as having superior quality in a case where an oxygen atom counts detected by Secondary Ion Mass Spectrometry in an interface between the titanium layer and the nickel layer is equal to or less than a threshold number that is predeterminedly set within a range equal to or less than 2×10 4 counts per second.