Liquid crystal display and fabricating method thereof
A liquid crystal display device includes: a liquid crystal display panel having a plurality of data lines and a plurality of gate lines crossing each other; a data drive circuit which supplies data voltages to the data lines; a gate drive circuit which supplies scan pulses to the gate lines; and first dummy pads on a substrate of the liquid crystal display panel at both sides of the data drive circuit, and wherein the data drive circuit is joined onto the substrate with a first anisotropic conductive film and both sides of the first anisotropic conductive film are joined to the first dummy pads.
1. A fabricating method of a liquid crystal display device, comprising the steps of:
forming a plurality of gate lines on a substrate;
forming an insulating layer on the gate lines;
simultaneously forming a plurality of data lines and first dummy pads on the insulating layer, wherein the data lines cross the gate lines, and wherein the first dummy pads are on both sides of where a data drive circuit will be pressed;
forming a passivation layer on the insulating layer including the data lines and the first dummy pads and completely removing the insulating layer from the first dummy pads;
joining a first anisotropic conductive film to the first dummy pads and to where the data drive circuit will be pressed; and
heat-pressing the data drive circuit, which supplies data voltages to the data lines, onto the first anisotropic conductive film.
2. The fabricating method according to claim 1 , further comprising the steps of:
forming second dummy pads on the insulating layer, wherein the second dummy pads are on both sides of where a gate drive circuit will be pressed;
joining a second anisotropic conductive film to the second dummy pads and to where the data drive circuit will be pressed; and
heat-pressing the gate drive circuit, which supplies scan pulses to the gate lines, onto the second anisotropic conductive film.
3. The fabricating method according to claim 1 or 2 , wherein the dummy pads include the same metal as the data line.
4. The fabricating method according to claim 1 or 2 , wherein the dummy pads include at least any one of molybdenum Mo, titanium Ti and tantalum Ta.
5. The fabricating method according to claim 1 or 2 , wherein a height of the dummy pads is not less than a height of the anisotropic conductive film.