Sensor assemblies used to detect the proximity of a material to a microwave element
View Patent ↗Sensor assemblies used to detect the proximity of a material to a microwave element are disclosed. One example sensor assembly includes a signal generator configured to generate at least one microwave signal, a coupler connected to the signal generator, a microwave element coupled to the coupler, and a processing module connected to the coupler. The microwave element is configured to generate an electromagnetic field as a function of said at least one microwave signal. The microwave element is structured to reflect a loading signal to said coupler when a material interacts with the electromagnetic field. The processing module is configured to process the loading signal with a reference signal to generate a data signal representative of the proximity of the material to the microwave element. The data signal defines a sub-microwave frequency.
1. A sensor assembly comprising:
a signal generator configured to generate at least one microwave signal;
a coupler connected to said signal generator;
a microwave element coupled to said coupler, said microwave element configured to generate an electromagnetic field as a function of said at least one microwave signal, wherein said microwave element is structured to reflect a loading signal to said coupler when a material interacts with the electromagnetic field; and
a processing module connected to said coupler, said processing module configured to process the loading signal with a reference signal to generate a data signal representative of the proximity of the material to the microwave element, wherein the data signal defines a sub-microwave frequency.
2. The sensor assembly of claim 1 , wherein said processor module is configured to generate the data signal having frequency up to about 1 MHz.
3. The sensor assembly of claim 1 , wherein said processing module comprises a frequency mixer configured to combine the loading signal with the reference signal.
4. The sensor assembly of claim 3 , wherein said signal generator is coupled to said processing module, and wherein said reference signal is substantially equal to the at least one microwave signal.
5. The sensor assembly of claim 3 , further comprising a reference signal generator coupled to said processing module, and wherein said processing module is configured to process the loading signal with said reference signal generated by said signal generator.
6. The sensor assembly of claim 5 , wherein said signal generator is configured to generate the reference signal having a frequency between about 300 MHz and about 6.0 GHz.
7. The sensor assembly of claim 3 , wherein said processing module comprises a signal processor and a low-pass filter coupled between said frequency mixer and said signal processor, said low-pass filter structured to attenuate frequencies at least above about 100 kHz.
8. The sensor assembly of claim 7 , wherein said signal processor is configured to determine the proximity of the material to said microwave element as a function of the filtered data signal.
9. The sensor assembly of claim 1 , wherein said coupler and said microwave element are enclosed in a single probe housing.
10. A power system comprising:
a component;
at least one sensor assembly disposed adjacent to said component, said at least one sensor assembly comprising:
a coupler;
a microwave element coupled to said coupler, said microwave element configured to generate an electromagnetic field as a function of at least one microwave signal, wherein said microwave element is configured to reflect a loading signal to said coupler when a material interacts with the electromagnetic field;
a processing module coupled to said coupler, said processing module configured to process the loading signal with a reference signal to generate a data signal representative of the proximity of the material to the microwave element, wherein the data signal defines a frequency below at least about 30 kHz; and
an electrical device coupled to said at least one sensor assembly.
11. The system of claim 10 , wherein said microwave element comprises a microwave emitter, and wherein said electrical device comprises at least one of a control system and a diagnostic system.
12. The system of claim 11 , wherein said processing module comprises an analog-to-digital converter configured to convert the data signal into a digital data signal, and a signal processor configured to determine the proximity of the material to said microwave element as a function of the digital data signal.
13. The system of claim 11 , wherein said component comprises a turbine shaft.
14. A method for use in detecting a material, said method comprising:
generating, at a microwave element, an electromagnetic field as a function of at least one microwave signal;
detuning said microwave element when a material interacts with the electromagnetic field to induce a loading signal to the microwave element; and
generating, at a processing module, a data signal from the loading signal and a reference signal, wherein the data signal is representative of the proximity of the material to the microwave element, and wherein the data signal defines a sub-microwave frequency.
15. The method of claim 14 , wherein the output signal defines a frequency up to about 100 MHz.
16. The method of claim 15 , wherein the output signal defines a frequency up to about 20 kHz.
17. The method of claim 16 , wherein said reference signal is approximately equal to the at least one microwave signal.
18. The method of claim 16 , further comprising:
converting the data signal to a digital signal; and
determining the proximity of the material to the microwave element as a function of the digital data signal.
19. The method of claim 14 , wherein generating the data signal comprises frequency mixing the loading signal with the reference signal.
20. The method of claim 14 , further comprising generating the reference signal such that the reference signal defines a frequency that is different than the at least one microwave signal.