Light emitting device package having dual recessed substrate
Disclosed is a light emitting device package. The light emitting device package includes a semiconductor substrate comprising a first surface at a first depth from an upper surface of the semiconductor substrate and a second surface at a second depth from the first surface; and a light emitting part on the second surface of the semiconductor substrate.
1. A light emitting device package comprising:
a substrate comprising a first surface having a first depth recessed from a upper surface of the substrate and a second surface having a second depth recessed from the first surface;
a light emitting chip on the second surface of the substrate; and
a first conductive layer electrically connected to the light emitting chip;
wherein the first conductive layer comprises a first metal layer on an outer side surface of the substrate and a second metal layer on a bottom surface of the substrate.
2. The light emitting device package of claim 1 , wherein the first metal layer and the second metal layer are electrically connected to an outer circumference of the substrate.
3. The light emitting device package of claim 1 , further comprising a second conductive layer electrically connected to the light emitting chip.
4. The light emitting device package of claim 3 , wherein the second conductive layer comprises a third metal layer on an outer side surface of the substrate and a fourth metal layer on a bottom surface of the substrate.
5. The light emitting device package of claim 4 , wherein the third metal layer and the fourth metal layer are electrically connected to an outer circumference of the substrate.
6. The light emitting device package of claim 1 , wherein the light emitting chip is below the first surface of the substrate.
7. The light emitting device package of claim 1 , wherein the first depth is longer than the second depth.
8. The light emitting device package of claim 1 , wherein the substrate comprises at least one via hole passing through the second surface.
9. The light emitting device package of claim 8 , wherein the first conductive layer is disposed below the substrate via the via hole.
10. The light emitting device package of claim 1 , wherein the second surface of the semiconductor substrate has an uneven shape.
11. The light emitting device package of claim 10 , wherein the uneven shape of the second surface comprises a V-shaped groove shape.
12. The light emitting device package of claim 1 , wherein a width of the first surface is wider than a width of the second surface.