PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE
A package manufacturing method of the present invention is a method of manufacturing a package with a recessed cavity formed in at least one of first and second substrates formed of a glass material and includes a cavity forming step of forming the cavity by performing press molding on at least one molded substrate of the first and second substrates and a heat treatment step of heating the molded substrate formed with the cavity.
1 . A method of manufacturing a package with a recessed cavity formed in at least one of first and second substrates formed of a glass material, the package manufacturing method comprising:
a cavity forming step of forming the cavity by performing press molding on at least one molded substrate of the first and second substrates; and:
a heat treatment step of heating the molded substrate formed with the cavity.
2 . The package manufacturing method according to claim 1 ,
wherein a polishing step of polishing a surface formed with the cavity is performed after the heat treatment step.
3 . The package manufacturing method according to claim 1 ,
wherein the molded substrate is formed of soda glass, and the temperature in the heat treatment step is equal to or larger than 600° C. and equal to or smaller than 700° C.
4 . The package manufacturing method according to claim 3 ,
wherein the temperature in the heat treatment step is equal to or larger than 670° C. and equal to or smaller than 680° C.
5 . A method of manufacturing a piezoelectric vibrator comprising:
a through hole forming step of forming a through hole, which communicates into the cavity, in the package manufactured by the manufacturing method according to claim 1 ;
a penetration electrode forming step of forming a penetration electrode by disposing a conductive material in the through hole; and
a piezoelectric vibrating reed mounting step of disposing a piezoelectric vibrating reed in the cavity and electrically connecting the piezoelectric vibrating reed and the penetration electrode to each other.
6 . An oscillator comprising:
the piezoelectric vibrator manufactured by the manufacturing method according to claim 5 , which is electrically connected to an integrated circuit, as a vibrator.
7 . An electronic device comprising:
the piezoelectric vibrator manufactured by the manufacturing method according to claim 5 which is electrically connected to a timepiece section.
8 . A radio-controlled timepiece comprising:
the piezoelectric vibrator manufactured by the manufacturing method according to claim 5 which is electrically connected to a filter section.