Sputtering target and method of fabrication
View Patent ↗A process is described for processing metal which includes clock rolling a metal plate until the desired thickness is achieved to form a rolled plate. Sputtering targets and other metal articles are further described.
1. A niobium metal plate that is circular in shape and having a rolling plane and a thickness of 0.080 to 1.5 inch, wherein said niobium metal plate is isotropic in said rolling plane and deforms isotropically in any direction within said rolling plane and said niobium metal plate has a crystallographic texture throughout said thickness wherein said crystallographic texture has a pole figure with an axial symmetrical texture with an axis normal to said rolling plane, wherein said axis has a primary axial <111> crystallographic texture, with <110> texture and <100> texture poles that are randomly distributed or have a symmetrical texture around said axis, or said axis has a primary axial <100> crystallographic texture, with <110> texture and <111> texture poles that are randomly distributed or have a symmetrical texture around said axis, and said niobium metal plate has a percent texture banding area of less than 0.5% with respect to overall area and volume of said niobium metal plate that is inconsistent or non-uniform with respect to the primary texture present in said niobium metal plate, and said niobium metal plate has a purity of at least 99.95% Nb and an average grain size of 150 microns or less.
2. The niobium plate of claim 1 , wherein said niobium metal plate is a sputter target disk.
3. The niobium metal plate of claim 1 , wherein said percent banding area is from 0.1 to 0.25%.
4. The niobium metal plate of claim 1 , wherein said axis is a primary axial <111> crystallographic texture, with <110> texture and <100> texture poles that are randomly distributed or have a symmetrical texture around said axis.
5. The niobium metal plate of claim 1 , wherein said axis is a primary axial <100> crystallographic texture, with <110> texture and <111> texture poles that are randomly distributed or have a symmetrical texture around said axis.
6. The niobium metal plate of claim 2 , further comprising a backing plate attached to said sputter target disk.
7. The niobium metal plate of claim 1 , wherein said primary texture is a primary (111) texture.
8. The niobium metal plate of claim 1 , wherein said percent texture banding area is with respect to (100) texture banding.
9. The niobium metal plate of claim 1 , wherein said metal article has a uniform mixed (111):(100) texture.
10. The niobium metal plate of claim 7 , wherein said niobium metal plate is a sputter target blank.
11. The niobium metal plate of claim 1 , wherein said niobium metal plate is a sputter target that is bonded to a backing plate.
12. The niobium metal plate of claim 1 , wherein percent banding area is from 0.1 to less than 0.5%.
13. The niobium metal plate of claim 1 , wherein percent banding area is from 0.1 to 0.4%.