IP Library Granted Patent US 8,486,295
Granted Patent B2
US 8,486,295 · App. 13/170,646 · Granted Jul 16, 2013

Alkyl perfluoroalkene ethers and uses thereof

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Quick Facts
Patent No.
US 8,486,295
App. No.
13/170,646
Granted
Jul 16, 2013
Kind
B2
Abstract

Disclosed are methods of transferring heat comprising providing a device, using a heat-transfer fluid to transfer heat to or from the device, wherein the heat-transfer fluid compositions comprise at least one unsaturated fluoroether having the formula CF 3 (CF 2 ) x CF═CFCF(OR)(CF 2 ) y CF 3 , CF 3 (CF 2 ) x C(OR)═CFCF 2 (CF 2 ) y CF 3 , CF 3 CF═CFCF(OR)(CF 2 ) x (CF 2 ) y CF 3 , CF 3 (CF 2 ) x CF═C(OR)CF 2 (CF 2 ) y CF 3 , or mixtures thereof, wherein R can be either CH 3 , C 2 H 5 or mixtures thereof, and wherein x and y are independently 0, 1, 2 or 3, and wherein x+y=0, 1, 2 or 3.

Claims (12)

1. A method for transferring heat comprising:

a. providing a device; and

b. using a heat-transfer fluid to transfer heat to or from the device, wherein the heat-transfer fluid comprises at least one unsaturated fluoroether having the formula CF 3 (CF 2 ) x CF═CFCF(OR)(CF 2 ) y CF 3 , wherein x and y are 1, and R is CH 3 .

2. The method of claim 1 , wherein the unsaturated fluoroether has a viscosity of less than 100 centistokes at −31° C.

3. The method of claim 1 , wherein the unsaturated fluoroether has a viscosity of less than 20 centistokes at −31° C.

4. An apparatus requiring heat transfer comprising:

a. a device; and

b. a mechanism for transferring heat to or from the device; comprising using a heat transfer fluid, wherein the heat transfer fluid comprises at least one unsaturated fluoroether having the formula CF 3 (CF 2 ) x CF═CFCF(OR)(CF 2 ) y CF 3 , wherein x and y are 1, and R is CH 3 .

5. The apparatus of claim 4 , wherein the device is heated.

6. The apparatus of claim 4 , wherein the device is cooled.

7. The apparatus of claim 4 , wherein the device is maintained at a selected temperature.

8. The apparatus of claim 4 , wherein the device is a microprocessor, wafer used to manufacture semiconductor devices, power control semiconductor, electrical distribution switch gear, power transformer, circuit board, multi-chip module, packaged and unpackaged semiconductor device, chemical reactor, nuclear reactor, fuel cell, laser, or missile component.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Apr 4, 2018
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: THE CHEMOURS COMPANY FC, LLC
Reel/Frame 045845/0913 →
SECURITY INTEREST Recorded Apr 4, 2018
From: THE CHEMOURS COMPANY FC, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 045846/0011 →
SECURITY AGREEMENT Recorded Jun 10, 2015
From: THE CHEMOURS COMPANY FC LLC; THE CHEMOURS COMPANY TT, LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 035839/0675 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2015
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: THE CHEMOURS COMPANY FC, LLC
Reel/Frame 035432/0023 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2013
From: BARTELT, JOAN ELLEN; LOUSENBERG, ROBERT D.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 030620/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2011
From: BARTELT, JOAN ELLEN
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 026676/0841 →