Article with metal grid composite and methods of preparing
View Patent ↗A laminate donor element can be used to transfer a composite of a metal grid and an electronically conductive polymer to a receiver sheet for use in various devices. The laminate donor element has a donor substrate, a metal grid that is disposed over only portions of the donor substrate, leaving portions of the substrate uncovered by the metal grid, and an electronically conductive polymer that covers the portions of the donor substrate that are uncovered by the metal grid. The composite of metal grid and electronically conductive polymer exhibits a peel force of less than or equal to 40 g/cm for separation from the donor substrate at room temperature. The resulting article has a substrate on which a reverse composite of the metal grid and electronically conductive polymer is disposed, which article can be incorporated into various devices.
1. An article comprising an article substrate, having thereon, in order, an adhesive layer and a composite comprising an electronically conductive polymer layer and a metal grid such that the metal grid is disposed over the adhesive layer and voids of the metal grid are filled by the electronically conductive polymer, and at least some of the metal grid is uncovered by the electronically conductive polymer.
2. The article of claim 1 wherein the adhesive layer comprises an epoxy, acrylate polymer, polyurethane, polyester, polyolefin, polycarbonate, polysiloxane, or a mixture thereof.
3. The article of claim 1 wherein the metal grid is disposed directly on the adhesive layer.
4. The article of claim 1 wherein the electronically conductive polymer layer is also disposed between the metal grid and the adhesive layer.
5. The article of claim 1 wherein the electronically conductive polymer layer comprises a substituted or unsubstituted thiophene-containing polymer, and the metal grid comprises two or more metal lines comprises at least one metal selected from the group consisting of silver, gold, copper, platinum, palladium, indium, tin, aluminum, and mixtures thereof.
6. The article of claim 1 wherein the electronically conductive polymer is a substituted or unsubstituted thiophene-containing polymer and the metal grid consists essentially of a plurality of silver lines.
7. The article of claim 1 wherein the article substrate is a transparent and flexible polymer or flexible glass.
8. An assembly comprising a laminate donor element in intimate contact with a receiver sheet comprising a receiver substrate,
the laminate donor element comprising, in order:
a donor substrate,
a metal grid comprising two or more metal lines that are in direct contact with only portions of the donor substrate, leaving portions of the donor substrate uncovered by the metal grid, and
an electronically conductive polymer layer that directly covers the portions of the donor substrate uncovered by the metal grid, and optionally directly covers at least some of the metal grid, thereby forming a composite of metal grid and electronically conductive polymer.
9. The assembly of claim 8 wherein the electronically conductive polymer layer comprises one or more members of the group consisting of substituted or unsubstituted pyrrole-containing polymers, substituted or unsubstituted thiophene-containing polymers, and substituted or unsubstituted aniline-containing polymers, and the metal grid comprises a plurality of metal lines comprising at least one metal selected from the group consisting of silver, gold, copper, platinum, palladium, tin, indium, aluminum, and mixtures thereof.
10. The assembly of claim 8 wherein the electronically conductive polymer layer comprises a substituted or unsubstituted thiophene-containing polymer, and the metal grid consists essentially of a plurality of silver lines,
wherein the metal grid covers at least 0.01% and up to and including 90% of the donor substrate surface area,
each silver line of the metal grid has an average width of at least 0.01 μm and up to and including 500 μm and an average height of at least 0.01 μm and up to and including 10 μm,
the electronically conductive polymer has an average thickness of at least 0.01 μm and up to and including 10 μm, and
the composite of the metal grid and electronically conductive polymer exhibits a peel force of less than or equal to 40 g/cm for separation from the donor substrate at room temperature.
11. The assembly of claim 8 wherein both the donor substrate and the receiver substrate are transparent and composed of the same or different flexible polymer or flexible glass.
12. The assembly of claim 8 further comprising an adhesive located between the receiver substrate and the donor substrate.
13. The assembly of claim 8 further comprising an adhesive located between the receiver substrate and the composite of metal grid and electronically conductive polymer.
14. An article comprising an article substrate having thereon a continuous electronically conductive polymer and a metal grid disposed within an outer surface of the continuous electronically conductive polymer layer such that voids of the metal grid are filled by the continuous electronically conductive polymer, and wherein the electronically conductive polymer is also disposed between the substrate and the metal grid.