IP Library Granted Patent US 10,259,200
Granted Patent B2
US 10,259,200 · App. 13/172,304 · Granted Apr 16, 2019

Solventless laminating adhesive for flexible packaging laminations and laminated structures made with the adhesive

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Quick Facts
Patent No.
US 10,259,200
App. No.
13/172,304
Granted
Apr 16, 2019
Kind
B2
Abstract

Two-component solventless adhesive compositions for lamination applications and laminated structures, including flexible laminated packaging, comprising at least two substrates, including structures comprising reverse printed ink films and/or metalized films. The adhesive comprises a prepolymer having one or more oligomers with a relatively high molecular weight.

Claims (9)

1. a laminate structure comprising

a) a first substrate of polyethylene terephthalate and having a first substrate surface with a water-base ink directly on the first substrate surface and a second substrate of metallized polyethylene terephthalate; and

b) a cured adhesive layer in contact with the water-base ink bonding the first substrate to the second substrate comprising a solventless two-component adhesive composition which prior to curing has a prepolymer comprising a first polyoxypropylene glycol having molecular weight of about 2,000 g/mole to about 5,000 g/mole and a second polyoxypropylene glycol having a molecular weight of about 5,500 g/mole to about 10,000 g/mole.

2. A process for making a laminated structure comprising the steps of

a) providing a first substrate and a second substrate each having an upper surface and a lower surface wherein the first substrate is polyethylene terephthalate and has a water-base ink directly on the upper surface or lower surface and the second substrate is metallized polyethylene terephthalate;

b) providing a solventless two-component adhesive composition which prior to curing has a prepolymer comprising a first polyoxypropylene glycol having a molecular weight of about 2,000 g/mole to about 5,000 g/mole and a second polyoxypropylene glycol having a molecular weight of about 5,500 g/mole to about 10,000 g/mole;

c) bonding the first substrate to the second substrate to form a laminated structure.

3. The process of claim 2 wherein the adhesive is applied by a method selected from the group consisting of roll coating, gravure and offset gravure.

4. The process of claim 2 wherein at least one of the first substrate or second substrate is surface treated.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2022
From: ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC
To: ARKEMA FRANCE
Reel/Frame 060740/0862 →
RELEASE OF PATENT SECURITY AGREEMENT Recorded Mar 18, 2013
From: THE BANK OF NOVA SCOTIA
To: ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC; AQUALON COMPANY; ISP INVESTMENTS INC.; HERCULES INCORPORATED
Reel/Frame 030025/0320 →
SECURITY AGREEMENT Recorded Sep 16, 2011
From: ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC; HERCULES INCORPORATED; AQUALON COMPANY; ISP INVESTMENT INC.
To: THE BANK OF NOVA SCOTIA, AS ADMINISTRATIVE AGENT
Reel/Frame 026918/0052 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 5, 2011
From: JOHNSON, RANDY A., MR.
To: ASHLAND LICENSING AND INTELLECTUAL PROPERTY LLC
Reel/Frame 026540/0987 →
Cited By (2)
US 12,384,872 US 12,441,832